XC5VLX30-1FF676C - 30K Logic Cell Virtex-5 LX FPGA, 676-BBGA | Xilinx
料号： XC5VLX30-1FF676C ✓ 量产中XC5VLX30-1FF676C 概述
An FPGA is a programmable semiconductor whose logic fabric, block RAM and dedicated hardware resources are configured at power-up from a bitstream held in external flash. Within the device hierarchy, the XC5VLX30-1FF676C sits in the Virtex-5 LX platform: Virtex-5 family, Virtex-5 LX sub-family, then LX device class, then the specific XC5VLX30 density. LX devices combine general-purpose configurable logic, dedicated DSP48E slices and multi-gigabit transceiver resources, making them the general-purpose member of the Virtex-5 line compared with the smaller Spartan-3 devices.
Key features of this part include the 676-ball flip-chip BGA package with a 1.0 mm ball pitch footprint, a -1 performance speed grade, and full Virtex-5 LX configuration support through ISPEED, CORE Generator and ISE Design Suite. The -1 suffix denotes the mid-range speed bin, which balances timing closure margin against cost and power versus the faster -2 grade. The 'C' package suffix denotes the commercial temperature grade, and the 'FF' package code identifies the 676-ball FCBGA option.
Architecturally the device uses the ASMBL column-based fabric with slice-based logic elements, distributed and block RAM, and dedicated DSP48E multiplier-accumulator blocks. Configuration data is loaded through the standard 8-bit or parallel JTAG/serial configuration ports, and the device supports multi-boot configuration handling for field updates. Because the fabric is SRAM-based, the configuration memory is volatile and a bitstream must be reloaded after each power cycle.
Typical applications for the XC5VLX30-1FF676C include telecommunications line cards and aggregation equipment, industrial control and test instrumentation, high-speed data acquisition, video and image processing pipelines, and any design needing multiple high-speed serial transceivers with logic capacity beyond small Spartan devices. It also serves well in prototype-to-production migration paths where a single 676-ball board footprint must support several density options.
Design considerations center on power delivery to the large BGA array and on thermal performance. A 676-ball FCBGA demands a multilayer PCB with a solid ground plane and careful decoupling close to every supply ball; use of a plane-power structure with stitching vias prevents supply droop at high toggle rates. Because Virtex-5 LX devices are legacy technologies, confirm availability and lifecycle status with AMD before committing to a long production run, and confirm the exact I/O standard, clocking resources and transceiver capabilities required by your design in the manufacturer datasheet.
This page consolidates distributor availability, verified drop-in alternatives in the same 676-ball footprint, and practical implementation guidance that engineers would otherwise have to piece together from multiple sources.
直接替换替代料： XC5VLX30-1FF676C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC5VLX30-1FF676C （相同外形与封装尺寸） ——差异在于 Device Type, Logic Cells, Speed Grade, Lead-Free Status, Number of Terminals.
XC5VLX30-1FFG676C
✅ 直接替换📋 参考替代料（不在目录中）
XC5VLX30-2FF676C
✅ 直接替换联系询价
查看数据手册 →XC5VLX50-1FF676
✅ 直接替换📋 参考替代料（不在目录中）
XC5VLX30-1FF676I
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC5VLX30-1FFG676I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC5VLX30-1FF676C 最大额定值与电气特性
| Device Type | Virtex-5 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 30,720 |
| Number of Gates | 1,179,648 |
| User I/O | 400 |
| 封装 | 676-BBGA (FCBGA), 676 balls |
| Number of Terminals | 676 |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| Architecture | ASMBL column-based FPGA, 2nd generation |
| Speed Grade | -1 |
| Temperature Grade | Commercial |
| Configuration Memory | SRAM-based, volatile (bitstream reload required at power-up) |
| RoHS 状态 | RoHS Non-Compliant |
| Lead Free Status | Contains Lead |
| Manufacturer | AMD / Xilinx |
XC5VLX30-1FF676C square 引脚配置指南
XC5VLX30-1FF676C（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC5VLX30-1FF676C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC5VLX30-1FF676C 适用于 6 应用s: Telecommunications Line-Card Aggregation, High-Speed Data Acquisition and Signal Processing, Industrial Control and Test Instrumentation, Video and Image Processing Pipelines, Aerospace and Defense Simulation Support, Network Equipment and Packet Processing.
Telecommunications Line-Card Aggregation
The XC5VLX30-1FF676C fits line-card and aggregation designs that must terminate multiple high-speed serial links while still hosting packet-processing logic. With 30,720 logic cells and 400 user I/O in a single 676-ball FCBGA, a design can place several transceiver channels, clock-domain-crossing logic and a management processor interface on one device instead of splitting the function across two parts. The -1 speed grade gives a reasonable timing margin for parallel backplane interfaces at moderate rates without the power penalty of the -2 grade. Because the fabric is SRAM-based, plan the configuration path early: use external SPI flash with a boot-golden bitstream so the card recovers automatically after power cycling, and reserve a JTAG header for field reprogramming.
推荐
High-Speed Data Acquisition and Signal Processing
Data acquisition front-ends that must convert, filter and packetise multiple channels benefit from combining dedicated DSP48E multiplier-accelerator blocks with 30,720 logic cells of general fabric. The XC5VLX30-1FF676C lets a designer place several parallel ADC interfaces, digital down-conversion chains and an interface to a host processor on a single device, avoiding inter-device data transfers that would add latency and clock-domain risk. The 400 user I/O provide ample parallel data buses for multiplexed converters, while the large BGA package keeps the footprint manageable on a multilayer board. Confirm DSP slice and block RAM quantities in the manufacturer data sheet against the filter bank design, and use the ASMBL column structure to place DSP slices adjacent to the buses they serve for timing closure.
推荐
Industrial Control and Test Instrumentation
In industrial controllers and automated test equipment, the XC5VLX30-1FF676C provides the mix of parallel I/O, timing resources and programmable logic that a sequencer or fixture controller needs. The 400 user I/O accommodate dense digital I/O, interlock and relay drive logic, and instrument control buses, while the -1 speed grade supports deterministic timing for pattern generation without over-specifying the design for higher power. The commercial temperature grade suits controlled indoor factory environments; if the equipment must operate in an unheated enclosure, step up to the industrial temperature variant of the same device. Because this is a mature platform, confirm that the AMD lifecycle status and the availability of the exact suffix match your production horizon before freezing the BOM.
推荐
Video and Image Processing Pipelines
Video processing nodes that need to move multi-megapixel frames through colour-space conversion, scaling and overlay stages fit the XC5VLX30-1FF676C's combination of logic capacity and I/O bandwidth. Four hundred user I/O allow parallel pixel buses to be driven and captured directly, and the logic cell count is sufficient for multi-stage pixel pipelines and frame buffers implemented in block RAM rather than external memory, which keeps latency predictable. The single-device approach also simplifies clocking, since one global clock tree can serve the whole pipeline instead of crossing package boundaries between multiple devices. For designs scaling beyond 30,720 logic cells, the LX50 in the same FF676 footprint is the documented upgrade path, so plan the board with that growth in mind from the outset.
推荐
Aerospace and Defense Simulation Support
Engineering-grade Virtex-5 LX devices are widely used in simulation, prototyping and ground-support equipment that needs deterministic, reprogrammable logic and a large, well-characterised I/O set. The XC5VLX30-1FF676C provides 400 user I/O for stimulus and response capture, 30,720 logic cells for behavioural models, and multi-gigabit serial resources for high-rate telemetry links in a single 676-ball FCBGA that can be reloaded in seconds through JTAG. For programs with extended temperature requirements, the industrial-grade ordering variant of the same device is the appropriate choice. Keep the bitstream under configuration control and store a golden image in external flash so the unit comes up in a known state after a power interruption in the field.
推荐
Network Equipment and Packet Processing
The XC5VLX30-1FF676C appears in line cards, aggregation shelves and protocol test equipment where packet classification, buffering and multi-port arbitration are handled in FPGA logic alongside several high-speed links. Thirty thousand logic cells are enough for a stack of headers, CRC and lookup engines, and the 400 I/O allow dense parallel backplane interfaces to terminate locally rather than being routed through external devices. The -1 grade balances timing margin and power in space-constrained shelves with limited airflow. Use the device in conjunction with external DDR memory for deep packet buffers, keep memory interfaces on dedicated I/O banks with proper VCCO assignment, and validate the transceiver channel count against the number of ports required before finalising the board.
推荐
推荐产品汇总
工程参考数据： XC5VLX30-1FF676C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC5VLX30-1FFG676C | XC5VLX30-2FF676C | XC5VLX50-1FF676 | XC5VLX30-1FF676I | XC5VLX30-1FFG676I |
|---|---|---|---|---|---|---|
| Package | 676-BBGA (FCBGA), FF676 | 676-BBGA (FCBGA), FF676 - same | 676-BBGA (FCBGA), FF676 - same | 676-BBGA (FCBGA), FF676 - same | 676-BBGA (FCBGA), FF676 - same | 676-BBGA (FCBGA), FF676 - same |
| Brand | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) | Xilinx (AMD) |
| Speed Grade | -1 | -1 | -2 (faster) | -1 | -1 | -1 |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Industrial | Industrial |
| Architecture | Virtex-5 LX, ASMBL column-based, SRAM configuration | Virtex-5 LX, ASMBL column-based, SRAM configuration | Virtex-5 LX, ASMBL column-based, SRAM configuration | Virtex-5 LX, ASMBL column-based, SRAM configuration | Virtex-5 LX, ASMBL column-based, SRAM configuration | Virtex-5 LX, ASMBL column-based, SRAM configuration |
关键差异点
- Regulatory-clean option in the identical footprint （对比 XC5VLX30-1FF676C)
- Speed-grade headroom without a package change （对比 XC5VLX30-1FF676C)
- Migration headroom without a PCB respin （对比 XC5VLX30-1FF676C)
- Single-device consolidation （对比 EP3C25F324C7)
设计说明
A 676-ball FCBGA concentrates supply current into a small number of VCC/VCCO balls, so the PCB must deliver power as a plane rather than as traces. Use a multilayer stackup with solid VCC and VCCO planes, place one bulk ceramic capacitor group per supply region, and add a 0.1 uF plus 1 uF decoupling pair within roughly 5 mm of every power ball group. Stitch vias between the power planes directly under the device and near the ball field to keep inductance low; without plane stitching, transient di/dt during high-toggle-rate operation can collapse the core rail and cause configuration or timing failures that look like a defective part.
Estimated: with the device consuming a few watts at the -1 speed grade in a dense Virtex-5 LX fabric, junction temperature is dominated by board copper rather than by the small BGA thermal area. As a starting point, a 4-layer board with roughly 25 square inches of copper spread under the part and no dedicated heat sink can hold the rise to a few tens of degrees Celsius; an aluminium heat spreader directly over the array improves this further. Route heat into the ground plane with a thermal via field, and verify with a thermocouple or thermal camera under worst-case toggle activity rather than relying on a nominal device power figure.
The fine-pitch 676-ball BGA cannot be assembled with conventional stencil and reflow alone; specify an X-ray inspection step and a board-level warp limit in the fabrication drawing. Because the package has no lead frame, the mechanical stress on solder joints comes entirely from board flatness and coefficient-of-thermal-expansion mismatch, so keep the assembled board flat and avoid mounting the assembly in a slot that bends it. Also plan the configuration circuitry early: SPI flash, a JTAG header and a mode-select pull-up network all need board space around the device and influence the ball-out and layer stackup.
Two frequent errors bite integrators of this device. First, ordering the non-G suffix part in a RoHS-restricted programme; the XC5VLX30-1FFG676C is the lead-free equivalent in the identical footprint, so select it deliberately at BOM review. Second, treating the -1 grade as interchangeable with -2 during timing closure: if the design closes only marginally at -1, migration to -2 changes power and thermal budget, not just the timing report. Third, forgetting that configuration memory is volatile, so a valid bitstream must be reloaded after every power cycle, including after a watchdog reset or brown-out event.
合规信息
RoHS status listed as RoHS Non-Compliant and lead free status listed as Contains Lead for the XC5VLX30-1FF676C. The XC5VLX30-1FFG676C is the lead-free RoHS-compliant ordering option in the same package. REACH, halogen-free and conflict-minerals declarations are not stated in the retrieved sources. AEC-Q100 does not apply to this industrial/commercial FPGA platform.
