XC5VLX50-3FF676C - Virtex-5 LX FPGA, 46,080 Cells, 676-FCBGA | AMD
料号： XC5VLX50-3FF676C ✓ 量产中XC5VLX50-3FF676C 概述
A field programmable gate array is a semiconductor device whose logic fabric, block RAM and input/output resources are configured at load time from a bitstream rather than being hard-wired at fabrication. The FPGA sits in the hierarchy between fixed-function logic ICs and application-specific standard products: an ASIC or microcontroller offers a fixed circuit, while an FPGA delivers parallel digital logic, dedicated memory and high-speed I/O on a single programmable die, then converts that die into one of many board-level functions after the design is complete.
Key features of this device include 1,769,472 total RAM bits for on-chip buffering, a 440-pin SelectIO user I/O complement for multi-lane interfaces, and a 65 nm CMOS process implementation that supports clock rates appropriate for telecommunications, industrial control and aerospace equipment. The -3 speed grade in the part number denotes a specific performance bin of the Virtex-5 LX family, and the FF676 suffix designates the 676-ball flip-chip BGA package.
Technically, the device combines configurable logic blocks with 6-input LUT-based logic, dedicated block RAM, DSP48 multiply-accumulate slices and hardened I/O with programmable differential and single-ended standards. Configuration is loaded from an external non-volatile memory or from a parallel or serial configuration interface, and the device supports partial reconfiguration of individual columns so long-running logic can be updated in the field without a complete power cycle.
Typical applications for the XC5VLX50-3FF676C include telecommunication line-card and switching equipment, industrial automation and motion control platforms, aerospace and defence avionics modules, high-speed instrumentation and test systems, and embedded video or image processing chains where the 440 I/O pins and 1.77 Mbit of block RAM remove the need for external memory on small formats.
A key design consideration is power and thermal management: at the 1.0 V nominal core rail this device concentrates significant dynamic current in a single 27 x 27 mm BGA, so the board must supply a clean 1 V rail with low-impedance decoupling and provide a solid thermal path through the board stack-up. Because the -3 grade is the slowest bin in the family, timing paths should be reviewed against the -1 and -2 alternatives if a design needs additional timing margin.
This page combines manufacturer device characteristics, drop-in speed-grade and temperature-grade alternatives from the same family, a parameter-by-parameter comparison table and practical design notes covering decoupling, thermal paths and configuration handling that are not consolidated anywhere else.
直接替换替代料： XC5VLX50-3FF676C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC5VLX50-3FF676C （相同外形与封装尺寸） ——差异在于 Device Type, Speed Grade, Logic Cells, Package, Package Type.
XC5VLX50-1FF676I
✅ 直接替换联系询价
查看数据手册 →XC5VLX50-2FF676I
✅ 直接替换联系询价
查看数据手册 →XC5VLX50-3FFG676I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC5VLX50-2FFG676C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC5VLX50-1FFG676I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC5VLX50-1FF676C
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →XC5VLX50-3FF676C 最大额定值与电气特性
| Device Type | Virtex-5 LX Field Programmable Gate Array (FPGA) |
| Logic Cells | 46,080 |
| Look-Up Tables (LUTs) | 3,600 |
| User I/O Pins | 440 |
| Total RAM Bits | 1,769,472 bits |
| Core Supply Voltage Range | 0.95 V to 1.05 V (1.0 V nominal) |
| 工作结温范围 | 0 °C to +85 °C |
| Process Technology | 65 nm CMOS |
| 封装 | 676-FCBGA (27 x 27 mm), BBGA / FCBGA |
| Number of Terminals | 676 balls |
| Terminal / Pitch Type | Ball (BGA), square package |
| 安装类型 | Surface Mount |
| Family | Virtex-5 LX |
| Speed Grade | -3 |
| Temperature Grade | Commercial (C) |
XC5VLX50-3FF676C 676-fcbga (27 x 27 mm), bbga / fcbga 引脚配置指南
XC5VLX50-3FF676C（676-fcbga (27 x 27 mm), bbga / fcbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC5VLX50-3FF676C.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC5VLX50-3FF676C 适用于 6 应用s: Telecommunication Line-Card and Cross-Connect Equipment, Industrial Automation and Motion Control Platforms, Aerospace, Defence and Avionics Modules, Test and Measurement Instrumentation, High-Speed Video and Image Processing, Embedded Networking and Protocol Conversion Bridges.
Telecommunication Line-Card and Cross-Connect Equipment
The XC5VLX50-3FF676C suits line-card, cross-connect and switching platforms that must terminate many parallel channels while running protocol logic at line rate. Its 440 user I/O pins cover multiple T1/E1 or serial transceiver interfaces, backplane links and management buses without an external I/O expander, while 1,769,472 RAM bits absorb packet buffering, FIFO depths and lookup tables on die. The 0.95 V to 1.05 V core rail integrates cleanly with the 1.0 V SerDes and clocking subsystems common in telecom line cards, and the 65 nm CMOS implementation gives predictable routing delay for time-division multiplexing fabrics. Note that the -3 speed bin needs margin checks on critical paths against the overall network timing budget.
推荐
Industrial Automation and Motion Control Platforms
For PLC, servo drive and machine-vision controllers, the XC5VLX50-3FF676C combines high-speed deterministic control logic with a large I/O complement in a single package. Multiple encoder, resolver and current-sense interfaces can be terminated directly on the 440 user I/O, and the on-chip block RAM stores motion profiles and position histories without external SRAM. Because the device is specified for a 0 °C to +85 °C junction range, it fits factory-floor cabinets with conditioned air in the -3 commercial grade; for unheated enclosures or extended ambient ranges, specify the XC5VLX50-3FFG676I industrial-temperature variant instead. The dense 676-ball FCBGA requires careful plane-based decoupling and a solid ground reference.
推荐
Aerospace, Defence and Avionics Modules
The XC5VLX50-3FF676C is used in avionics and defence electronics modules where a compact, high-pin-count programmable fabric replaces multiple discrete CPLDs and FPGAs. Radar signal conditioning, countermeasure processing and avionics bus management all benefit from the combination of 46,080 logic cells, 3,600 LUTs, dedicated DSP48 multiply-accumulate resources and 440 I/O in one 27 x 27 mm package. For programmes requiring extended environmental range, the XC5VLX50-3FFG676I provides the identical pinout at an industrial junction rating. Because the device is a mature 65 nm product, programme teams should confirm date-code traceability, radiation and screening options, and long-term availability commitments through the Request a Quote process before freezing the design.
推荐
Test and Measurement Instrumentation
High-end oscilloscopes, logic analysers and protocol analysers need wide capture bandwidth, deep acquisition memory and a large number of front-panel and probe interface pins. The XC5VLX50-3FF676C provides 440 user I/O for multiple acquisition channels, digital compare inputs and trigger fan-out, and its 1,769,472 RAM bits hold short records and correlation windows on chip, reducing external memory pressure on lower-cost instruments. The programmable logic can also implement trigger state machines, histogram and decimation pipelines, and serial protocol decode engines in parallel. Instrument makers typically pair the FPGA with DDR2 memory for deep capture and a small companion MCU for front-panel control, while the -3 speed grade keeps the design within a predictable timing envelope for sample-clock pipelines.
推荐
High-Speed Video and Image Processing
Machine-vision cameras, video walls and medical imaging head-ends benefit from the XC5VLX50-3FF676C because 440 user I/O can absorb multiple parallel pixel or lane interfaces and control signals while the logic fabric performs colour conversion, gamma correction and scaler pipelines at line rate. DSP48 slices handle the multiply-accumulate stages of FIR filters and matrix transforms, and the 1.77 Mbit of block RAM holds line buffers and colour lookup tables without external SRAM in small form factors. The 0.95 V to 1.05 V core rail pairs naturally with 1.0 V SerDes and parallel-LVDS input structures common in camera modules. Designs with tight pixel-clock budgets should verify timing at the -3 bin or move to the -2 grade for margin.
推荐
Embedded Networking and Protocol Conversion Bridges
The XC5VLX50-3FF676C is widely used for protocol conversion and aggregation in embedded network equipment, where a mix of legacy parallel buses and modern serial links must be bridged. The 440 I/O pins support multiple parallel Ethernet or legacy storage interfaces, while the FPGA fabric terminates serial links and implements packet framing, FIFO isolation and protocol translation. Block RAM supports descriptor queues and back-pressure buffering, allowing deterministic traffic shaping across mismatched link rates. A common architecture pairs this Virtex-5 LX with a smaller companion FPGA for link management and a microcontroller for control-plane configuration, while the 0.95 V to 1.05 V core rail keeps the design compatible with single-rail 1.0 V power trees in carrier equipment.
推荐
推荐产品汇总
工程参考数据： XC5VLX50-3FF676C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC5VLX50-1FF676I | XC5VLX50-2FF676I | XC5VLX50-3FFG676I | XC5VLX50-2FFG676C | XC5VLX50-1FFG676I | XC5VLX50-1FF676C |
|---|---|---|---|---|---|---|---|
| Package | 676-FCBGA (27x27) | 676-FCBGA (27x27) - identical | 676-FCBGA (27x27) - identical | 676-FCBGA (27x27) - identical | 676-FCBGA (27x27) - identical | 676-FCBGA (27x27) - identical | 676-FCBGA (27x27) - identical |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Speed Grade | -3 | -1 (faster) | -2 (faster) | -3 (identical) | -2 (faster) | -1 (faster) | -1 (faster) |
| Temperature Grade | Commercial, 0 °C to +85 °C junction | Industrial, extended below 0 °C | Industrial, extended below 0 °C | Industrial, extended below 0 °C | Commercial, 0 °C to +85 °C junction | Industrial, extended below 0 °C | Commercial, 0 °C to +85 °C junction |
| Logic Cells | 46,080 | 46,080 | 46,080 | 46,080 | 46,080 | 46,080 | 46,080 |
| Look-Up Tables | 3,600 | 3,600 | 3,600 | 3,600 | 3,600 | 3,600 | 3,600 |
| User I/O Pins | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Total RAM Bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits | 1,769,472 bits |
| Core Supply Voltage | 0.95 V to 1.05 V (1.0 V nominal) | 0.95 V to 1.05 V (1.0 V nominal) | 0.95 V to 1.05 V (1.0 V nominal) | 0.95 V to 1.05 V (1.0 V nominal) | 0.95 V to 1.05 V (1.0 V nominal) | 0.95 V to 1.05 V (1.0 V nominal) | 0.95 V to 1.05 V (1.0 V nominal) |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
| Family | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX | Virtex-5 LX |
| Number of Terminals | 676 balls | 676 balls | 676 balls | 676 balls | 676 balls | 676 balls | 676 balls |
关键差异点
- Widest sourcing flexibility in the Virtex-5 LX speed and temperature matrix （对比 XC5VLX50-2FF676I)
- Pin-compatible path to industrial temperature without a PCB change （对比 XC5VLX50-3FFG676I)
- Timing headroom upgrade for margin-constrained designs （对比 XC5VLX50-1FF676C)
- Deterministic resource set identical across all drop-in options （对比 XC5VLX50-2FFG676C)
设计说明
The XC5VLX50-3FF676C runs from a 0.95 V to 1.05 V core rail, and dynamic current scales with clock frequency and I/O toggle activity, so the 1.0 V rail must be planned as a high-current, low-voltage net. Route VCC as a full plane with the maximum possible number of connections, keep the plane free of splits, and place bulk ceramic capacitance at the board entry plus distributed 0.1 uF-to-1 uF decoupling close to the supply and ground ball groups. Estimated: with a 1.0 V rail, every 100 mA of average current drawn corresponds to 0.1 W of supply power, so a design running 1.5 A average at the core is already dissipating about 1.5 W in the rail before board losses.
Because all 46,080 logic cells, the DSP48 slices and 440 I/O share a single 27 x 27 mm FCBGA substrate, junction temperature rises directly with total dissipated power and inversely with the board's effective thermal resistance. Use the manufacturer power estimator with the post-implementation utilisation report to establish average and worst-case dissipation, then confirm with a thermal simulation of the actual stack-up, including the number of inner copper planes and any heat spreader or heat sink. Estimated: a dissipation of 2.0 W through a 20 C/W effective path still produces about a 40 °C junction rise, which matters when the ambient already sits near the top of the 0 °C to +85 °C junction window.
A 676-ball flip-chip BGA demands escape routing discipline. Follow the manufacturer package drawing for ball assignments to power, ground and user I/O, and use a full or partial via-in-pad or microvia strategy with a buried via fanout so that each signal ball can escape without long stubs. Keep the ground reference plane continuous under the entire device area, because every high-speed user I/O return path depends on it, and route configuration pins away from switching or high-current nets to avoid coupling during load. Assembly also requires confirming the board's coefficient of thermal expansion against the ceramic substrate to control warpage on large boards.
The most common mistake with this device is assuming that speed-grade and temperature-grade suffixes are interchangeable without re-running implementation. The XC5VLX50-3FF676C is the slowest speed bin, so a bitstream that closes timing with margin on -1 may fail timing on -3, and the ISE or Vivado timing report must be regenerated for the exact grade. A second common error is ignoring configuration integrity: use the supported parallel or serial configuration interface with proper CCLK timing, and check that the configuration memory interface matches the device's supported flash or PROM type before taping out.
The 440 user I/O banks in this device support single-ended and differential standards with programmable drive strength, slew and termination. For high-speed links, prefer the lowest drive strength that still meets the edge-rate requirement, add source-series termination where the datasheet's I/O recommendation calls for it, and keep high-speed pairs length-matched to within the tolerance given for the selected I/O standard. Since the core runs at only 1.0 V, keep noise on the supply plane below the device's ripple and offset limits, because the small core voltage leaves little margin for supply-induced jitter on the internal clock network.
合规信息
The Virtex-5 LX family is a mature 65 nm industrial product line; RoHS, REACH and halogen-free declarations are confirmed per ordering code through the manufacturer's compliance documentation and the Request a Quote process on this page. Automotive-qualified versions are ordered as a separate part number.
