XC6SLX16-3FTG256I - Spartan-6 LX FPGA, 14K Logic Cells, 256-FTBGA | AMD Xilinx
料号： XC6SLX16-3FTG256I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $24.9 | $24,900.00 |
XC6SLX16-3FTG256I 概述
A field-programmable gate array (FPGA) is a semiconductor device built from an array of programmable logic blocks, programmable interconnect, programmable I/O cells, and dedicated hard IP such as block RAM, DSP slices, and clock management tiles. Within the broader taxonomy it sits alongside CPLDs, gate arrays, and ASICs as a re-programmable digital logic device; FPGAs differ from CPLDs mainly in density and architectural granularity, and differ from ASICs by being configurable post-fabrication. The Spartan-6 LX family is positioned by AMD Xilinx as the cost-optimized, low-power member of the Spartan-6 generation, ideal for bridging, display, and motor-control in ASICs and ASSPs.
Key features include integrated block RAM up to 589,824 bits, dual 10/100/1000 Mbps Ethernet MAC hardening options, a low-power 45 nm process with 1.2 V core voltage, integrated PCI Express endpoint block in LXT variants, and a programmable I/O voltage range that supports common single-ended and differential standards. The CLB array contains 1,139 logic cells arranged to deliver balanced logic, memory, and DSP resources, and the package's fine-pitch BGA delivers compact board area while keeping signal integrity manageable for the supported I/O rates.
Spartan-6 LX uses the proven 45 nm CMOS process and the 6th-generation Xilinx FPGA architecture, bringing logic, block RAM, DSP48A1 slices, and clock management tiles (CMT) into a low-cost fabric. Memory controllers (hard MCBs) support DDR, DDR2, DDR3, and LPDDR external memory interfaces up to 800 Mb/s data rates, and the integrated GTP serial transceivers in LXT parts deliver multi-gigabit connectivity for cost-sensitive serial links.
Typical applications for the XC6SLX16-3FTG256I include industrial motor-control and PLC backplanes, low-cost video bridging and consumer display controllers, automotive infotainment and telematics subsystems, machine-vision front ends, and PCIe endpoint cards in cost-sensitive computing. The wide industrial temperature range and high I/O count make it a frequent building block in factory automation and embedded vision designs.
When designing with this FPGA, ensure that the I/O bank voltages reference the classfree reference design, ensure that the configuration memory (typically a SPI or BPI flash) is sized for the bitstream, and ensure that the FPGA's power-on sequencing and decoupling network match the Spartan-6 power distribution guidance in UG393 to ensure reliable industrial-temperature operation. Designers should also budget for ISE Design Suite or Vivado (legacy) toolchain support and the appropriate license.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers an at-a-glance view of where the XC6SLX16-3FTG256I fits in the Spartan-6 LX family and what alternatives exist for sourcing continuity.
直接替换替代料： XC6SLX16-3FTG256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX16-3FTG256I （相同外形与封装尺寸） ——差异在于 Configurable Logic Blocks (CLBs), Mounting Type, Operating Temperature, Package, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
XC6SLX16-2FTG256I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX16-3FTG256C
✅ 直接替换✓ 有现货
$24.5 / 个
查看数据手册 →XA6SLX16-3FTG256I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX16-3FTG256Q
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX25-3FTG256I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX16-3FTG256I 最大额定值与电气特性
| Family | Spartan-6 LX |
| Logic Cells | 14,579 |
| Configurable Logic Blocks (CLBs) | 1,139 |
| Block RAM | 589,824 bits |
| Maximum User I/O | 186 |
| 封装 | 256-ball FTBGA, 17 x 17 mm, 1.0 mm pitch |
| Process Technology | 45 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | -3 (highest performance in Spartan-6 LX) |
| 工作温度 | -40C to +100C (Industrial, I) |
| Internal Operating Frequency | Up to 667 MHz |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | RoHS Compliant (Lead Free) |
| Configuration Memory Support | SPI, BPI, JTAG, Master Serial |
XC6SLX16-3FTG256I 引脚配置
| 引脚 A1 | IO_L1N_0 — Bank 0, I/O pair N side |
| 引脚 A2 | IO_L2P_0 — Bank 0, I/O pair P side |
| 引脚 A3 | IO_L2N_0 — Bank 0, I/O pair N side |
| 引脚 A4 | IO_L3P_0 — Bank 0, I/O pair P side |
| 引脚 A5 | VCCO_0 — Bank 0 I/O supply voltage |
| 引脚 A6 | IO_L4N_0 — Bank 0, I/O pair N side |
| 引脚 A7 | IO_L5P_0 — Bank 0, I/O pair P side |
| 引脚 A8 | IO_L5N_0 — Bank 0, I/O pair N side |
| 引脚 A9 | GND — Ground |
| 引脚 A10 | IO_L6P_0 — Bank 0, I/O pair P side |
| 引脚 A11 | IO_L6N_0 — Bank 0, I/O pair N side |
| 引脚 A12 | VCCO_0 — Bank 0 I/O supply voltage |
| 引脚 A13 | IO_L7P_0 — Bank 0, I/O pair P side |
| 引脚 A14 | IO_L7N_0 — Bank 0, I/O pair N side |
| 引脚 A15 | IO_L8P_0 — Bank 0, I/O pair P side |
| 引脚 A16 | IO_L8N_0 — Bank 0, I/O pair N side |
典型应用
XC6SLX16-3FTG256I 适用于 6 应用s: Industrial Motor Control and PLC, Low-Cost Display Bridging and Consumer Video, Automotive Infotainment and Telematics, Machine Vision Front End, PCIe Endpoint Cards in Cost-Sensitive Computing, Industrial Networking and Protocol Bridging.
Industrial Motor Control and PLC
The XC6SLX16-3FTG256I's 14,579 logic cells and 186 user I/O in a 256-ball FTBGA package are well-matched to industrial PLC and multi-axis motor control designs. The industrial temperature range (-40C to +100C) handles factory-floor thermal stress while the dedicated DSP48A1 slices handle field-oriented control (FOC) math at high PWM rates. The -3 speed grade gives margin for 200 kHz current loop rates on multi-axis drives. Companion components include ADCs for current sensing (e.g., ADS131M04) and gate drivers (e.g., UCC21530QDWKRQ1) - the latter being a Site MPN that already has a XAIPART product page.
推荐
Low-Cost Display Bridging and Consumer Video
The Spartan-6 LX family is widely deployed in display bridging ASICs where the XC6SLX16's block RAM and LVDS-capable I/O handle pixel buffering and protocol conversion. The -3 speed grade supports LVDS rates common in flat panel TV and monitor panels, while 589,824 bits of block RAM provides line-store memory for scaler and deinterlacer pipelines. The FTG256 package's 1.0 mm pitch ball allows compact PCB routing in slim consumer enclosures.
推荐
Automotive Infotainment and Telematics
The XC6SLX16-3FTG256I handles video processing, CAN/LIN bridging, and audio routing in cost-sensitive automotive infotainment head units and rear-seat entertainment modules. Designers needing AEC-Q100 qualification should select the XA6SLX16-3FTG256I variant in the same FTG256 footprint. The -3 speed grade supports video overlay and graphics acceleration up to 1080p60 with appropriate memory bandwidth.
推荐
Machine Vision Front End
The XC6SLX16-3FTG256I is a popular low-cost choice for industrial machine vision front ends that interface to MIPI or parallel image sensors and pre-process frames before forwarding to a host CPU. The 589 Kb block RAM provides line buffers for image pipelines, while the 186 user I/O supports wide parallel sensor interfaces. The industrial temperature range supports factory floor deployment, and the -3 speed grade delivers image processing throughput at typical VGA to 2MP frame rates.
推荐
PCIe Endpoint Cards in Cost-Sensitive Computing
Spartan-6 LX FPGAs in the LXT subfamily (with hard PCIe endpoint block) are widely used for low-cost PCIe endpoint cards in test, instrumentation, and data acquisition. The XC6SLX16-LX16T variant adds the integrated PCIe block; for the LX variant without integrated PCIe, designers use a soft PCIe IP core. The -3 speed grade delivers reliable GTP operation at PCIe Gen1 rates, while the 256-ball FTG256 footprint supports compact card designs.
推荐
Industrial Networking and Protocol Bridging
The XC6SLX16-3FTG256I integrates easily with multi-protocol industrial networking bridges (EtherCAT, PROFINET, EtherNet/IP) thanks to its 186 I/O, high-speed transceivers, and abundant block RAM for buffering. The industrial temperature range is required for factory automation deployments. Companion components include Ethernet PHYs (e.g., VSC8531XMW-05, a Site MPN) and isolated transceivers.
推荐
推荐产品汇总
工程参考数据： XC6SLX16-3FTG256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX16-2FTG256I | XC6SLX16-3FTG256C | XA6SLX16-3FTG256I | XC6SLX16-3FTG256Q | XC6SLX25-3FTG256I |
|---|---|---|---|---|---|---|
| Package | 256-ball FTBGA (17x17 mm, 1.0 mm pitch) | 256-ball FTBGA - same | 256-ball FTBGA - same | 256-ball FTBGA - same | 256-ball FTBGA - same | 256-ball FTBGA - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Logic Cells | 14,579 | 14,579 | 14,579 | 14,579 | 14,579 | 24,051 |
| Speed Grade | -3 | -2 | -3 | -3 | -3 | -3 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +100C (Defense) | -40C to +100C (Industrial) |
| AEC-Q100 Qualified | No | No | No | Yes | No (XQ defense grade) | No |
| Block RAM (bits) | 589,824 | 589,824 | 589,824 | 589,824 | 589,824 | 958,464 |
| Maximum User I/O | 186 | 186 | 186 | 186 | 186 | 186 |
| Process / Core Voltage | 45 nm / 1.2 V | 45 nm / 1.2 V | 45 nm / 1.2 V | 45 nm / 1.2 V | 45 nm / 1.2 V | 45 nm / 1.2 V |
关键差异点
- Highest-performance -3 speed grade within Spartan-6 LX family （对比 XC6SLX16-2FTG256I)
- Industrial temperature range for harsh deployments （对比 XC6SLX16-3FTG256C)
- Mature Xilinx toolchain and IP ecosystem （对比 Lattice ECP5 (LFE5U series))
设计说明
The XC6SLX16-3FTG256I requires separate supplies for VCCINT (1.2 V core), VCCAUX (2.5 V or 3.3 V auxiliary), and per-bank VCCO supplies (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on I/O standard). Each supply must be decoupled with a 100 nF ceramic capacitor per supply pin within 5 mm of the ball, plus bulk decoupling on each supply rail per the Spartan-6 power distribution guide (UG393). A common pitfall is to share VCCAUX with VCCO when they should be separate; refer to UG393 for proper sequencing.
The 256-ball FTG256 package has a theta-JA of approximately 25-30 C/W on a standard 4-layer JEDEC test board. Estimated: at full utilization (~80% logic + 100% I/O toggle), junction-to-ambient temperature rise is roughly 15-20C above ambient. For enclosed industrial environments at 70C ambient, the junction temperature stays well below the 100C industrial limit. Always verify thermal performance in the actual system enclosure using the Xilinx Power Estimator (XPE) spreadsheet.
The FTG256 package uses a 1.0 mm ball pitch with 17 x 17 mm body. PCB design requires 4-layer stack-up at minimum with 0.5 mm via-in-pad recommended for BGA escape routing. Use a 4-mil trace/space rule for signal layers and dedicated ground/power planes under the BGA for return current. The Xilinx BGA escape routing guidance (UG393) recommends dog-bone fan-out with the first via at the ball pad.
Common pitfalls include: (1) mis-setting the M0/M2 mode pins and selecting the wrong configuration mode (e.g., Master Serial vs SPI); (2) omitting the 100 nF cap on the DONE pin pull-up; (3) tying the PROGRAM_B pin incorrectly - it must be pulled high through a 4.7 kohm resistor and pulled low for at least 100 ns to initiate reconfiguration; (4) using a JTAG clock rate above the maximum 25 MHz; (5) configuring VCCO banks without verifying the I/O standard's voltage compatibility. Re-read SOP-MU for configuration problems.
合规信息
RoHS compliant and lead-free per AMD Xilinx product page. The standard XC6SLX16-3FTG256I is not AEC-Q100 qualified; the XA6SLX16 variant is AEC-Q100 qualified for automotive applications. Spartan-6 family is in active production but mature status; designers should plan for end-of-life announcements in the multi-year horizon.
