XC6SLX25-3FT256I - 24,051-Cell Spartan-6 LX FPGA | AMD
料号： XC6SLX25-3FT256I ✗ 停产XC6SLX25-3FT256I 概述
A field-programmable gate array is a programmable logic device that converts a digital design into an interconnected array of configurable logic blocks and programmable I/O. In the product hierarchy, an FPGA is a programmable logic semiconductor, a broader category than a fixed-function application-specific integrated circuit. The Spartan-6 LX family balances programmable logic capacity, embedded memory, connectivity, and cost for embedded, industrial, communications, and signal-processing systems.
Key features include 24,051 logic cells organized into 1,879 CLBs, 3,758 adaptive logic modules, and 936 kbit of embedded memory according to the comparison data retrieved for this family. The device provides 186 user I/O and uses a 256-ball lead-free package. Its 500 MHz internal-frequency listing, -3 performance grade, 45 nm CMOS construction, and 1.2 V core supply make it suitable for designs requiring substantial parallel processing without moving to a larger FPGA family.
The LX device architecture combines programmable logic, block RAM, digital signal processing resources, general-purpose I/O, clock management, and dedicated configuration capabilities. These resources allow designers to implement parallel datapaths, control logic, protocol interfaces, and data acquisition functions in one device. The 24,051-cell capacity also permits more substantial consolidation than small CPLDs, while the 256-ball package provides a defined route for dense, board-level integration.
Typical applications include industrial automation, embedded control, communications infrastructure, instrumentation, data acquisition, and digital signal processing. The target part is particularly relevant when a design must combine moderate-to-high logic density with a 256-ball Spartan-6 LX footprint and the -3 speed grade. Designers should also verify power, configuration, memory interface, and pin constraints against their complete system requirements.
A critical design step is to match the exact device variant, package drawing, exposed-pad treatment, and PCB land pattern before production. Configuration storage, clocking, decoupling, signal integrity, and thermal performance must be reviewed against AMD's Spartan-6 documentation. Do not infer full pin compatibility from a shared ball count alone.
This page consolidates verified distributor specifications, exact package information, source links, and drop-in alternatives with engineering-oriented selection guidance. It also distinguishes documented facts from parameters that require confirmation, providing a more practical basis for procurement and hardware planning than a distributor listing alone.
直接替换替代料： XC6SLX25-3FT256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX25-3FT256I （相同外形与封装尺寸） ——差异在于 Package, Device Type, Logic Cells, Mounting Type, RoHS Status.
XC6SLX25-3FTG256I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC6SLX25-3FTG256C
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX25-2FT256I
✅ 直接替换联系询价
查看数据手册 →XC6SLX25-2FTG256I
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX25-2FTG256C
✅ 直接替换📋 参考替代料（不在目录中）
XC6SLX25-1FT256I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC6SLX25-3FT256I 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| Device Family | Spartan-6 LX |
| Logic Cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs |
| Adaptive Logic Modules | 3,758 ALMs |
| Embedded Memory | 936 kbit |
| User I/O | 186 I/O |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | -3 |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| 封装 | 256-LBGA, 17 x 17 mm |
| 工作温度 | 0°C to 85°C |
| Termination | Lead-free |
| RoHS 状态 | Compliant |
XC6SLX25-3FT256I 256-lbga, 17 x 17 mm 引脚配置指南
XC6SLX25-3FT256I（256-lbga, 17 x 17 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX25-3FT256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX25-3FT256I 适用于 6 应用s: Industrial Automation and Control, Data Acquisition and Instrumentation, Communications and Network Interface, Digital Signal Processing, Embedded Control and General-Purpose Logic, Video and Image Processing.
Industrial Automation and Control
The XC6SLX25-3FT256I fits industrial machine-control systems requiring parallel logic, multiple interfaces, and deterministic configuration in one programmable device. Its 24,051 logic cells and 1,879 CLBs provide substantially more implementation capacity than a small CPLD, while the listed 186 I/O can support digital sensors, actuator interfaces, and field-bus connectivity. The 500 MHz internal-frequency figure indicates the device's internal processing capability, although actual control-loop timing depends on the selected clock, I/O standards, routing, and tool constraints. Engineers should use the -3 grade for designs with demanding timing paths and verify the target's 0°C to 85°C specification against the enclosure environment.
推荐
Data Acquisition and Instrumentation
The XC6SLX25-3FT256I is appropriate for parallel data-acquisition, trigger, and processing subsystems because its 24,051-cell Spartan-6 LX architecture can combine sampling control, buffering, filtering, and interface logic in a single device. The family data lists 3,758 adaptive logic modules and 936 kbit of embedded memory, allowing parallel datapaths and local buffering to be implemented efficiently. Its 186 I/O supports multiple acquisition channels and control signals when the PCB and pin-assignment plan are designed carefully. Engineers must budget acquisition timing, clock jitter, input thresholds, grounding, and analog-interface isolation outside the FPGA, and verify every selected pin against the exact AMD package file.
推荐
Communications and Network Interface
The XC6SLX25-3FT256I can implement communication line handling, packet processing, framing, buffering, and control functions when a design needs more programmable capacity than discrete logic provides. The Spartan-6 LX family's 24,051 logic cells, 186 I/O, and 936 kbit embedded-memory listing support parallel protocol implementations and reusable datapath resources. The -3 grade is the preferred choice when internal processing must meet a tighter timing budget, while XC6SLX25-2FT256I may be sufficient where the lower grade closes timing and improves sourcing. Final selection requires checking the required transceiver or PHY, clocking, impedance, I/O standards, and whether package-bounded routing preserves signal integrity.
推荐
Digital Signal Processing
The XC6SLX25-3FT256I is suitable for parallel DSP, filtering, correlation, waveform generation, and fixed-point processing because the Spartan-6 LX device provides 24,051 logic cells, 3,758 ALMs, and dedicated FPGA resources for parallel arithmetic. The listed 500 MHz internal frequency and highest-performance -3 grade give designers more timing margin than the -2 and -1 alternatives when implementing pipelined datapaths. The device can consolidate control, memory, and processing functions into one package, reducing inter-chip data movement. Engineers should use vendor-supported DSP tools, account for block RAM and DSP-resource limits, and check clock-quality requirements because external SDRAM interfaces and high-speed transceivers require separate board-level validation.
推荐
Embedded Control and General-Purpose Logic
The XC6SLX25-3FT256I supports embedded-control consolidation by placing state machines, arithmetic, memory management, and peripheral interfaces into a single Spartan-6 LX FPGA. The 24,051-cell capacity allows several control subsystems to coexist while retaining 186 I/O for sensors, displays, relays, and communications. Unlike a fixed-function microcontroller, the FPGA permits logic to be adapted during development, which is useful for evolving industrial or equipment-control platforms. The implementation must still include boot or configuration support, watchdog behavior, clock initialization, reset sequencing, and safe output states. Verify the 0°C to 85°C operating specification and any facility-level reliability requirements before environmental qualification.
推荐
Video and Image Processing
The XC6SLX25-3FT256I can support parallel image acquisition, pixel transport, color conversion, thresholding, and display timing functions in a programmable compact package. Its 24,051 logic cells and 1,879 CLBs allow multiple video pipelines to share the device, while 186 I/O provides a meaningful interface budget for parallel sensors, memory, and control signals. The -3 speed grade offers additional timing margin for pixel-clock and multi-clock designs compared with lower speed-grade options. Practical implementation requires checking whether external video memory is needed, confirming supported I/O rates and standards, controlling data skew, and validating the 256-ball package's power and thermal distribution under the intended switching activity.
推荐
推荐产品汇总
工程参考数据： XC6SLX25-3FT256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX25-3FTG256I | XC6SLX25-3FTG256C | XC6SLX25-2FT256I | XC6SLX25-2FTG256I | XC6SLX25-2FTG256C | XC6SLX25-1FT256I |
|---|---|---|---|---|---|---|---|
| Package | 256-LBGA, 17 x 17 mm | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| Brand | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx | AMD / Xilinx |
| Logic Cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells | 24,051 cells |
| Configurable Logic Blocks | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs | 1,879 CLBs |
| Speed Grade | -3, highest-performance Spartan-6 LX grade | -3 | -3 | -2 | -2 | -2 | -1 |
| Embedded Memory | 936 kbit | 936 kbit | 936 kbit | 936 kbit | 936 kbit | 936 kbit | 936 kbit |
| User I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O | 186 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
关键差异点
- Highest listed Spartan-6 LX speed grade （对比 XC6SLX25-2FT256I)
- Identical documented logic density （对比 XC6SLX25-3FTG256C)
- Matching 186-I/O resource count （对比 XC6SLX25-2FTG256I)
设计说明
Create or update the PCB footprint only from AMD's controlled Spartan-6 package files for the exact XC6SLX25-3FT256I variant. The verified distributor information identifies a 256-ball lead-free package, but a shared 256-ball count does not establish identical pad geometry, ball assignment, thermal-pad treatment, or paste layout. Compare the package outline, pitch, solder-mask definition, and documentation revision before release, then run the PCB assembler's land-pattern and courtyard checks.
Decouple the 1.2 V core rail locally and follow the voltage, current, and sequencing requirements in the applicable AMD device documentation. Place the required bulk and high-frequency capacitors close to their assigned power balls, use multiple ground connections with an uninterrupted return path, and keep switching-regulator loops away from sensitive configuration and clock inputs. Do not use the 1.2 V core value as a substitute for the device's complete power-rail table.
Estimate worst-case FPGA power from the actual design's toggle rate, resource utilization, clocking, I/O activity, and selected speed grade rather than relying only on the -3 device rating. Validate the thermal design with the package's specified thermal model and the completed PCB stack-up. For a 256-ball BGA, via-in-pad construction, thermal-via arrays, copper spreading, and adjacent component placement can materially affect heat removal, especially in compact industrial equipment.
Review every high-speed interface with the exact package pin assignment and the selected I/O standard in the FPGA design tool. Match external memory, transceiver, and interface traces to the documented impedance and topology requirements, and observe clock and data skew budgets across the BGA. The -3 speed grade changes internal timing but does not compensate for an incorrectly routed external interface; use post-route timing and board-level signal-integrity validation before production.
Do not assume that any 256-ball Spartan-6 LX ordering code is automatically interchangeable. The speed grade, FT versus FTG package designation, I versus C temperature suffix, configuration behavior, and package revision can affect the substitution decision. Load the exact alternative device in the AMD tool, compare utilization and pin constraints, confirm the mechanical drawing, and complete timing and power signoff before approving a drop-in change.
合规信息
The verified LCSC datasheet source identifies the XC6SLX25-3FT256I as RoHS compliant and lead-free. REACH, AEC-Q100, halogen-free, and conflict-minerals status were not established by the supplied data. The operating-temperature listing of 0°C to 85°C comes from DigChip and should be checked against the controlled AMD ordering documentation.
