XC6SLX75-3CSG484I - 74637-Cell Spartan-6 LX FPGA | AMD
料号： XC6SLX75-3CSG484I ✓ 量产中XC6SLX75-3CSG484I 概述
A field-programmable gate array, or FPGA, is a reconfigurable semiconductor whose internal digital circuitry is defined by a configuration bitstream rather than fixed mask programming. Within the product hierarchy, an FPGA belongs to the programmable-logic and semiconductor families. The Spartan-6 LX family is positioned for cost-sensitive embedded systems requiring substantial parallel processing, deterministic interfaces, and flexible hardware updates without changing the printed circuit board.
The XC6SLX75 combines 74,637 configurable logic cells with 5,831 CLBs and 328 reported I/O locations in the 484-pin CSPBGA package. Its 45 nm CMOS construction supports integration of logic, memory, and DSP blocks, while its -3 speed grade identifies one of the higher-performance grades described for the Spartan-6 LX family. The CSBGA package has a 1 mm pitch and a reported body size of 23 × 23 mm according to the retrieved distributor data.
Spartan-6 devices support parallel processing, serial connectivity, and programmable logic through configurable I/O resources. This device family can implement control logic, communication bridges, data acquisition pipelines, embedded processors, and hardware signal-processing functions. Because a complete system can be implemented in programmable logic, the FPGA can also support field upgrades, product differentiation, and reduced external-component count when its resources match the design requirements.
Typical uses include industrial automation and factory control, networked communications, test and measurement equipment, embedded video processing, data acquisition, and embedded processing platforms. The 74,637-cell count is particularly useful for designs that need multiple parallel channels or a combination of control logic and DSP. Designers must still verify the exact pin assignments, power rails, supported I/O standards, memory configuration, and transceiver features against the applicable AMD package and device documentation.
Board-level implementation requires careful high-speed layout, continuous supply planes, correct BGA escape routing, and decoupling near the package power and ground balls. The 1 mm-pitch CSPBGA also demands controlled assembly processes, including suitable stencil design, solder-paste inspection, and thermal verification. External memory interfaces, serial links, and user I/O should be routed according to the official package pinout files and device-specific layout guidance.
This product record combines verified distributor specifications, package information, pricing references, and same-package replacement findings with practical selection guidance. The alternative list is intentionally limited to candidates supported by the supplied cross-reference results, avoiding unsupported cross-package substitutions or packaging-only variants presented as drop-in replacements.
直接替换替代料： XC6SLX75-3CSG484I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC6SLX75-3CSG484I （相同外形与封装尺寸） ——差异在于 Logic Cells, Operating Temperature, Process Technology, Speed Grade.
XC6SLX75-2CSG484I
✅ 直接替换联系询价
查看数据手册 →XC6SLX75-3CSG484C
✅ 直接替换联系询价
查看数据手册 →XC6SLX75-3CSG484I 最大额定值与电气特性
| Device Type | Spartan-6 LX field-programmable gate array |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| I/O Count | 328 I/O |
| Internal Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| 工作温度 | 0 °C to 85 °C |
| Package Type | 484-pin CSPBGA |
| Package Body Size | 23 mm × 23 mm |
| Package Pitch | 1.0 mm |
| 安装类型 | Surface mount |
| Speed Grade | -3 |
| Series | Spartan-6 LX |
| Lead-Free Status | Lead-free |
XC6SLX75-3CSG484I 1.0 mm 引脚配置指南
XC6SLX75-3CSG484I（1.0 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC6SLX75-3CSG484I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC6SLX75-3CSG484I 适用于 6 应用s: Industrial Automation Controller, Communications Gateway, Data Acquisition System, Test and Measurement Instrument, Embedded Processing Platform, Programmable Logic Controller.
Industrial Automation Controller
The XC6SLX75-3CSG484I fits industrial automation controllers that coordinate sensors, actuators, interlocks, and communication links in parallel. Its 74,637 logic cells and 5,831 CLBs provide substantial combinational and sequential logic capacity, while 328 I/O support device integration at the board level. A practical implementation would use programmable logic for motion sequencing, safety-state handling, and real-time control. The -3 grade can be valuable when timing margins are tight, but engineers must verify actual I/O standards and derive internal clock requirements. The 484-pin CSPBGA also requires constrained BGA layout, solid return paths, and careful power decoupling.
推荐
Communications Gateway
The XC6SLX75-3CSG484I is suitable for protocol conversion, packet routing, and data-plane functions in communications equipment. The 74,637-cell Spartan-6 LX resource count allows parallel framing logic, buffering, and interface adaptation, while the device’s programmable architecture supports revisions without a board respin. Designers can place the FPGA beside a network interface or embedded processor and partition functions according to timing and I/O requirements. The -3 performance grade may improve timing headroom, but exact transceiver support, supported I/O standards, and maximum interface rates must be confirmed in the AMD documentation. A one-to-two-inch separation from high-speed data sources is also prudent.
推荐
Data Acquisition System
The XC6SLX75-3CSG484I can implement parallel acquisition, digital filtering, and data-format conversion when a design requires more deterministic throughput than a software-only processor can provide. Its 74,637 logic cells and 5,831 CLBs allow multiple parallel channels to be combined with buffering and control logic. The FPGA can separate data capture from downstream transfer while the reported 667 MHz internal figure supports high clocking headroom, although practical performance depends on routing and the selected interfaces. External ADC and DAC devices should be placed with short, impedance-controlled routes, and the complete power, ground, clock, and I/O specifications must be validated before release.
推荐
Test and Measurement Instrument
The XC6SLX75-3CSG484I fits programmable test and measurement logic that must coordinate timing, pattern generation, data capture, and data processing. The 74,637-cell count allows substantial measurement pipelines to be consolidated into a single programmable-logic device, while 328 I/O provide connections to converters, memory, and control peripherals. Engineers can assign timing-critical functions to the FPGA and reserve higher-level management for a companion processor. The -3 grade supports designs where routing margin is important, but the configuration must still satisfy setup-and-hold, clock uncertainty, and output-drive requirements for each interface. Thermal and power analysis should include both core and I/O power.
推荐
Embedded Processing Platform
The XC6SLX75-3CSG484I can serve as the programmable fabric in an embedded processing platform, combining a soft processor, dedicated hardware accelerators, memory interfaces, and communication logic. The 74,637 logic cells provide more capacity than a small microcontroller for concurrent tasks, while the -3 grade can improve timing headroom for tightly scheduled pipelines. A practical design may use the FPGA for deterministic datapath work and a microcontroller for configuration, boot, and supervisory functions. Because the supplied data does not quantify block RAM, DSP slices, or transceiver counts, those resources must be checked against the selected bitstream and device documentation before committing to a particular architecture.
推荐
Programmable Logic Controller
The XC6SLX75-3CSG484I is appropriate for a high-channel-count programmable logic controller that must execute multiple state machines and respond to many discrete inputs. Its 5,831 CLBs and 74,637 logic cells can host parallel control, sequencing, diagnostics, and communication functions, while the 328 I/O provide substantial board-level connectivity. The -3 speed grade is advantageous for designs with demanding timing paths, although exact input thresholds, I/O standards, and drive capabilities remain to be verified from official documentation. The 1 mm-pitch CSPBGA requires manufacturing control, and any safety-related or long-lifecycle qualification should be verified independently rather than inferred from commercial availability.
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推荐产品汇总
工程参考数据： XC6SLX75-3CSG484I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC6SLX75-2CSG484I | XC6SLX75-3CSG484C |
|---|---|---|---|
| Package | 484-pin CSBGA | 484-pin CSBGA | 484-pin CSBGA |
| Brand | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 74,637 cells | 74,637 cells | 74,637 cells |
| Speed Grade | -3 | -2 | -3 |
关键差异点
- Higher -3 performance grade than the documented -2 alternative （对比 XC6SLX75-2CSG484I)
- Retains the -3 speed grade with the same package （对比 XC6SLX75-3CSG484C)
- Same-package sourcing avoids PCB redesign （对比 XC6SLX75-2CSG484I)
设计说明
Treat the 484-pin CSPBGA as a high-density routing and assembly constraint rather than a conventional perimeter package. Use the official AMD package files to assign power, ground, configuration, clock, and user-I/O balls before committing to board geometry. Provide continuous return paths, adequate BGA escape capacity, and manufacturing rules appropriate for the verified 1.0 mm pitch. The retrieved package dimensions must also be reconciled against the selected package drawing before release.
Decouple each supported supply rail according to the manufacturer’s recommended circuit and place the capacitors close to the corresponding package balls. Separate core and I/O current paths where the device documentation calls for distinct rails, and verify steady-state plus transient demand. The public snippets confirm a 1.2 V core but do not provide the complete supply-voltage table, so no additional rail values should be assumed during schematic design.
Route clocks, high-speed serial interfaces, and memory connections with continuous reference planes and short return paths. The reported 667 MHz internal frequency does not define every external interface rate, so each I/O standard, edge rate, skew budget, and termination scheme must be established from the official device documentation. Use source-synchronous routing rules where applicable and reserve suitable test points for configuration, clock, and supply verification.
Do not treat the XC6SLX75T LXT variant as a drop-in substitute merely because it uses a similar CSBGA package; the supplied comparison identifies a different Spartan-6 family. Likewise, speed- and temperature-grade changes require engineering review rather than a visual package comparison. Before substitution, recompile the bitstream, confirm timing closure, validate configuration behavior, and confirm the full operating-temperature requirement against the selected ordering code.
合规信息
The supplied FindIC result explicitly describes the device as lead-free. RoHS, REACH, halogen-free, and conflict-minerals statements were not included in the verified snippets and are therefore recorded as unknown. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified semiconductor product.
