XC7A35T-1FTG256I - 33K Cell Artix-7 FPGA | AMD
料号： XC7A35T-1FTG256I ✓ 量产中XC7A35T-1FTG256I 概述
An FPGA is a reconfigurable semiconductor in the programmable-logic and digital-semiciconductor hierarchy. Unlike a fixed-function microcontroller or DSP, its lookup tables, routing fabric, block RAM, DSP slices, and I/O can be programmed after manufacture. The Artix-7 family combines this programmable architecture with high-speed serial links, analog mixed-signal resources, and a cost-optimized focus on performance per watt.
Key features include 33,280 logic cells for combinational and sequential designs, 170 user I/Os for external interfaces, and 90 DSP slices for multiply and accumulate operations. The 1.84 Mb of block RAM provides dedicated on-chip storage, while the 950 mV to 1.05 V core-voltage range supports power-conscious FPGA configurations. Its 256-ball FTBGA package supports dense PCB routing but requires careful via, escape-routing, thermal, and assembly planning.
The XC7A35T combines programmable logic, hard DSP blocks, block RAM, memory-mapped resources, and programmable I/O in one device. A 464 MHz associated timing rating provides a useful design target, although achievable system performance depends on the selected clocking resources, timing constraints, routing congestion, memory interfaces, I/O standards, and implemented design. Because the part is an FPGA, both hardware configuration and the device bitstream must be validated as a complete system.
Typical uses include industrial control and automation, communications and protocol conversion, instrumentation, embedded video, digital signal processing, and low-power edge systems. The 170 I/Os and 90 DSP slices make the device particularly suitable for designs that combine sensor acquisition, control logic, and real-time arithmetic without relying on several separate programmable devices.
The primary design consideration is package implementation. A 256-ball FTBGA demands fine-pitch escape routing, a qualified PCB stack-up, adequate thermal spreading, and assembly processes capable of handling the package geometry. Designers should also confirm the exact power, configuration, and clock requirements against the manufacturer Artix-7 documentation before releasing the schematic or layout.
This page consolidates the verified distributor specifications, same-package Artix-7 alternatives, comparative engineering data, and practical implementation guidance. It is intended to help engineers identify the correct FPGA variant, evaluate replacement options, and plan a manufacturable 256-ball BGA design without treating non-identical family members as automatic drop-in replacements.
直接替换替代料： XC7A35T-1FTG256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7A35T-1FTG256I （相同外形与封装尺寸） ——差异在于 Package, Block RAM, Logic Cells, DSP Slices, Mounting Type.
XC7A35T-1FTG256C
✅ 直接替换联系询价
查看数据手册 →XC7A35T-2FTG256I
✅ 直接替换联系询价
查看数据手册 →XC7A35T-L1FTG256I
✅ 直接替换📋 参考替代料（不在目录中）
XC7A35T-3FTG256I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7A35T-L2FTG256I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7A35T-1FTG256I 最大额定值与电气特性
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 33,280 cells |
| User I/O Count | 170 I/Os |
| Block RAM | 1.84 Mb |
| DSP Slices | 90 slices |
| Associated Maximum Clock Frequency | 464 MHz |
| Core Voltage Range | 950 mV to 1.05 V |
| FPGA Process Technology | 28 nm |
| 封装 | 256-ball FTBGA |
| Device Family | Artix-7 |
| Programmable Logic Type | Reconfigurable FPGA |
XC7A35T-1FTG256I 256-ball ftbga 引脚配置指南
XC7A35T-1FTG256I（256-ball ftbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC7A35T-1FTG256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC7A35T-1FTG256I 适用于 6 应用s: Industrial Control and Automation, Communications and Protocol Conversion, Digital Signal Processing and Filtering, Instrumentation and Data Acquisition, Embedded Video and Image Processing, Low-Power Edge Processing.
Industrial Control and Automation
XC7A35T-1FTG256I fits compact industrial controllers that coordinate sensors, actuators, communications, and real-time control logic. Its 33,280 logic cells provide capacity for parallel state machines and protocol handling, while 90 DSP slices can accelerate filtering or arithmetic associated with acquisition and feedback loops. The 170 I/Os support board-level sensing and control without requiring a separate programmable device for every interface. Using a 256-ball FTBGA also permits dense routing among the FPGA, memory, transceivers, and power circuitry. Engineering validation should include industrial-temperature qualification, signal-integrity review for external interfaces, and static timing analysis for every clock domain before production release.
推荐
Communications and Protocol Conversion
XC7A35T-1FTG256I is suitable for communications equipment that must translate between multiple digital interfaces or implement custom framing and buffering. Its 33,280 logic cells can support parallel transmit and receive datapaths, while 1.84 Mb of block RAM provides dedicated storage for packet queues, descriptors, and framing state. The associated 464 MHz clock rating gives designers a defined performance reference for synchronous logic, subject to actual timing closure. The 170 available I/Os can distribute parallel data, control, clocks, and status signals. For a production design, verify transceiver I/O standards, pin constraints, timing margins, clock-jitter requirements, and bitstream compatibility against the selected board architecture.
推荐
Digital Signal Processing and Filtering
XC7A35T-1FTG256I can implement real-time digital signal processing where deterministic parallel arithmetic is required. Its 90 DSP slices are suited to multiply, multiply-accumulate, filtering, and fixed-point pipeline operations, while 33,280 logic cells support control, address generation, and interface logic. The 1.84 Mb of block RAM allows samples, correlation data, or intermediate results to remain on-chip and reduces pressure on external memory. A practical implementation should map the numerical pipeline to DSP48 resources, constrain clocks carefully, and account for arithmetic growth and quantization. The associated 464 MHz rating is a device reference, not a guaranteed sample rate, so the actual throughput must be established through pipelining and static timing analysis.
推荐
Instrumentation and Data Acquisition
XC7A35T-1FTG256I is appropriate for instrumentation that combines high-rate data capture, digital filtering, calibration, and a host interface. The 170 I/Os allow parallel ADC or DAC data buses, trigger signals, counters, and communication links to be integrated in one programmable device. The 90 DSP slices can implement digital filters or correction algorithms, and the 1.84 Mb of block RAM can buffer acquisition records before transmission. The associated 464 MHz rating supports analysis of pipelined processing stages, although actual input rates depend on I/O timing and the selected clocking architecture. Engineers should evaluate input thresholds, clocking jitter, timing closure, grounding, and data-conversion interfaces before assigning the FPGA to a precision measurement system.
推荐
Embedded Video and Image Processing
XC7A35T-1FTG256I can support compact image-processing pipelines that require programmable logic, parallel pixel movement, and moderate arithmetic throughput. The 33,280 logic cells are useful for line buffers, timing generators, pixel control, and interface state machines, while 90 DSP slices can accelerate selected filtering or pixel calculations. The 1.84 Mb of block RAM provides local storage, although full-frame buffers may require external memory depending on resolution and color depth. The 170 I/Os allow connection to image sensors, displays, and memory interfaces. A practical design must confirm supported I/O standards, video timing, memory bandwidth, power integrity, and timing closure; the associated 464 MHz rating alone does not determine achievable pixel throughput.
推荐
Low-Power Edge Processing
XC7A35T-1FTG256I can be used in compact edge systems that require programmable sensing, protocol handling, and local control without a separate processor for every function. Its 170 I/Os support multiple sensors and peripheral interfaces, while 90 DSP slices enable local arithmetic and 1.84 Mb of block RAM provides on-chip buffering. For battery- or thermally constrained installations, the related XC7A35T-L1FTG256I may be considered because the verified comparison identifies the same core resources and FTG256 package in a low-power family variant. The final choice should compare actual power at the required clock and I/O activity, wake-up behavior, thermal dissipation, and whether the design closes timing in the selected operating mode.
推荐
推荐产品汇总
工程参考数据： XC7A35T-1FTG256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7A35T-1FTG256C | XC7A35T-2FTG256I | XC7A35T-L1FTG256I | XC7A35T-3FTG256I | XC7A35T-L2FTG256I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FTBGA-256 (FTG256) | FTBGA-256 (FTG256) - same | FTBGA-256 (FTG256) - same | FTBGA-256 (FTG256) - same | FTBGA-256 (FTG256) - same | FTBGA-256 (FTG256) - same |
| Speed Grade | -1 speed grade | -1 speed grade | -2 speed grade | -1 speed grade | -3 speed grade | -2 speed grade |
| Power Class | Standard Artix-7 family | Standard Artix-7 family | Standard Artix-7 family | Low-power Artix-7 family | Standard Artix-7 family | Low-power Artix-7 family |
关键差异点
- Provides the complete verified resource mix for moderately complex control and signal-processing systems （对比 XC7A35T-L1FTG256I)
- Standard -1 speed grade provides a potentially lower-cost timing option than higher speed grades （对比 XC7A35T-2FTG256I)
- Industrial-temperature suffix identifies the target ordering option for qualified industrial environments （对比 XC7A35T-1FTG256C)
- Higher speed grades can offer additional timing margin without changing the PCB land pattern （对比 XC7A35T-3FTG256I)
设计说明
Treat the 256-ball FTBGA as a fine-pitch assembly and routing constraint rather than a conventional peripheral package. Use the official AMD package pinout files and UG475 package specification to define every ball, power region, and I/O-bank assignment. The PCB stack-up, ball-pitch escape geometry, solder-mask and paste design, via strategy, and component placement must be reviewed together with the assembly house before fabrication.
Plan the power tree from the verified 950 mV to 1.05 V core-voltage requirement, while separating core and auxiliary supplies according to the manufacturer power guide. Place decoupling capacitance at the appropriate supply pins with very short return paths, and verify the selected capacitors against effective capacitance, DC-bias derating, and switching behavior. Do not infer a complete power budget from the core-voltage range alone; use the selected speed grade, I/O activity, configuration method, and actual design utilization.
The 256-ball BGA conducts much of its heat through the package and PCB rather than through visible leads. Provide uninterrupted copper beneath the device where the package design permits, apply the manufacturer-recommended thermal-via pattern, and evaluate junction temperature using the actual board stack-up and enclosure. Estimated: power dissipation equals core, auxiliary, and I/O power summed from the selected operating state; temperature rise must then be checked against the applicable device limit.
Assign clocks and high-speed interfaces through the official pinout and I/O-bank constraints rather than by numerical adjacency alone. Validate trace impedance, reference-plane continuity, return paths, skew, and termination with the actual stack-up. The associated 464 MHz rating is not a substitute for interface-specific timing analysis. Any change from the -1 grade to a -2 or -3 alternative should be followed by fresh constraint, timing, and board-level signal-integrity verification.
合规信息
The supplied verified data does not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for this ordering code. These fields remain unknown rather than being inferred from the manufacturer or device family.
