XC7A75T-3CSG324E - Artix-7 210-I/O FPGA | AMD
料号： XC7A75T-3CSG324E ✓ 量产中XC7A75T-3CSG324E 概述
An FPGA is a reconfigurable digital semiconductor in which programmable logic blocks, memory, and I/O resources implement custom digital systems after fabrication. Artix-7 belongs to the broader FPGA and programmable-logic hierarchy, combining parallel programmable logic with digital signal processing, clock management, block RAM, and high-speed serial transceivers. This makes the device suitable when design flexibility is more important than the power efficiency of a fixed-function ASIC.
The XC7A75T provides 75,520 logic cells and 210 I/O in one compact package. Its 628 MHz maximum switching frequency supports demanding control, acquisition, communications, and embedded-processing designs. The 324-LFBGA configuration also exposes substantially more interconnect and I/O resources than the smaller Artix-7 packages, making it appropriate for board-level designs that need multiple high-speed interfaces and external memory connections.
The device contains mixed resources rather than only general-purpose gates. Depending on the selected Artix-7 configuration, these can include dedicated block RAM, digital signal processing slices, clock-management resources, and high-speed transceivers. This heterogeneous architecture allows parallel data paths, time-domain functions, packet handling, and control logic to share one programmable device, reducing the number of supporting ICs on a complex board.
Typical uses include industrial automation, test and measurement, communication equipment, embedded instrumentation, and high-speed digital control. The 210-I/O count is particularly useful for parallel sensor interfaces, memory buses, board-level control, and multi-channel acquisition. Designers must still account for speed grade, temperature grade, power budgeting, pin constraints, and the high pin count when laying out the BGA PCB.
A critical implementation consideration is the CSG324 BGA footprint. Its 0.8 mm ball pitch requires a constrained-layer PCB, precise component placement, appropriate escape routing, and careful via-in-pad or fanout strategy. Power delivery must also support the 950 mV to 1.05 V core range while keeping each supply rail within its published limits.
This page combines the verified distributor and manufacturer information for the XC7A75T-3CSG324E with same-package family alternatives, comparison parameters, application guidance, and practical PCB considerations. It distinguishes confirmed values from specifications that still require verification against the complete manufacturer datasheet.
直接替换替代料： XC7A75T-3CSG324E ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： XC7A75T-3CSG324E （相同外形与封装尺寸） ——差异在于 Package.
XC7A75T-2CSG324I
✅ 直接替换联系询价
查看数据手册 →XC7A75T-1CSG324I
✅ 直接替换📋 参考替代料（不在目录中）
XC7A75T-2CSG324E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7A75T-1CSG324E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7A75T-3CSG324C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XC7A75T-3CSG324E 最大额定值与电气特性
| Manufacturer | AMD |
| FPGA Family | Artix-7 |
| Device Type | Field Programmable Gate Array (FPGA) |
| Logic Cells | 75,520 cells |
| User I/O | 210 I/O |
| Maximum Switching Frequency | 628 MHz |
| Core Voltage Range | 950 mV to 1.05 V |
| 封装 | 324-LFBGA, CSPBGA |
| Package Pin Count | 324 pins |
| 安装类型 | Surface Mount |
XC7A75T-3CSG324E 324 pins 引脚配置指南
XC7A75T-3CSG324E（324 pins 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XC7A75T-3CSG324E.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XC7A75T-3CSG324E 适用于 6 应用s: Industrial Automation Controllers, Test and Measurement Equipment, Communication and Protocol Equipment, Embedded Instrumentation, High-Speed Digital Control, Digital Signal Processing Systems.
Industrial Automation Controllers
The XC7A75T-3CSG324E fits industrial automation controllers that combine parallel machine I/O with configurable digital logic. Its 75,520 logic cells can implement sequencing, protocol handling, and control functions, while 210 user I/O provide substantial connectivity to sensors, actuators, and field buses. The 628 MHz maximum switching frequency supports timing-sensitive control logic, although the exact I/O standards must be checked against the device's full pinout. For a production design, verify the E temperature suffix, industrial EMC requirements, isolation strategy, and BGA manufacturing capability before qualification.
推荐
Test and Measurement Equipment
The XC7A75T-3CSG324E is suitable for modular test and measurement systems requiring concurrent acquisition, control, and data processing. Its 210 I/O can support instrument interfaces and parallel test channels, while 75,520 logic cells provide capacity for timing engines, trigger logic, and digital signal processing. The 628 MHz maximum switching frequency helps preserve margin in high-rate digital sections. Designers should confirm whether their chosen architecture requires specific transceivers, block RAM, or DSP resources, because their exact quantities were not present in the verified snippets.
推荐
Communication and Protocol Equipment
XC7A75T-3CSG324E can support programmable communication equipment, interface adapters, and protocol concentrators where parallel logic and flexible I/O are important. The 75,520 logic cells allow multiple packet-processing paths, buffering, and state machines to coexist, while 210 I/O can connect external transceivers, memories, and backplanes. Its 628 MHz maximum switching frequency is useful for demanding digital datapaths. Exact high-speed transceiver features and pin assignments should be confirmed from the complete Artix-7 documentation before selecting board components or signal-integrity parameters.
推荐
Embedded Instrumentation
The XC7A75T-3CSG324E fits embedded instrumentation platforms that must combine sensor conditioning interfaces, digital acquisition, local processing, and control. Its 210 I/O offers broad parallel connectivity, while 75,520 logic cells can implement filters, decoders, correction algorithms, and supervisory logic. The 950 mV to 1.05 V core-voltage range and 628 MHz maximum switching frequency provide useful design boundaries for power and timing analysis. Because the verified sources do not enumerate memory, DSP, or transceiver resources, these requirements must be checked against the detailed device tables before final architecture selection.
推荐
High-Speed Digital Control
XC7A75T-3CSG324E is appropriate for high-speed digital control systems requiring deterministic programmable behavior and extensive external connectivity. Its 628 MHz maximum switching frequency supports complex state machines, timing generators, and parallel datapaths, while 210 I/O reduces the need for external glue logic. The 75,520 logic cells allow substantial control functionality to be consolidated into one FPGA. Timing closure should use the correct -3 speed-grade timing tables, and PCB designers must plan the 324-LFBGA escape routing and power delivery before committing to the device.
推荐
Digital Signal Processing Systems
The XC7A75T-3CSG324E can serve in programmable DSP systems that need a high ratio of external data paths to logic resources. The 210 I/O supports parallel converters, memory interfaces, and synchronization channels, while 75,520 logic cells support filters, control, and data movement. Its 628 MHz maximum switching frequency provides a clear timing target for synchronous designs. Exact DSP-slice and block-RAM counts were not provided in the verified source set, so sample throughput and memory-depth claims must be verified from the complete Artix-7 resource tables before implementation.
推荐
推荐产品汇总
工程参考数据： XC7A75T-3CSG324E ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7A75T-2CSG324I | XC7A75T-1CSG324I | XC7A75T-2CSG324E | XC7A75T-1CSG324E | XC7A75T-3CSG324C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 324-LFBGA (CSG324) | 324-LFBGA (CSG324) - same | 324-LFBGA (CSG324) - same | 324-LFBGA (CSG324) - same | 324-LFBGA (CSG324) - same | 324-LFBGA (CSG324) - same |
| FPGA Family | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 | Artix-7 |
| Speed Grade | -3 | -2 | -1 | -2 | -1 | -3 |
| Temperature Suffix | E | I | I | E | E | C |
关键差异点
- Highest performance ordering grade in the documented comparison set （对比 XC7A75T-2CSG324I)
- Maintains the requested E suffix while offering lower-speed comparison points （对比 XC7A75T-1CSG324E)
- Same -3 speed grade for grade-focused reviews （对比 XC7A75T-3CSG324C)
设计说明
Treat the 324-LFBGA package as a fine-pitch BGA design constraint and use the official AMD package drawing before defining the PCB footprint. The verified sources establish 324 balls but do not provide pitch or pad dimensions. Confirm ball-map compatibility with AMD's Artix-7 package pinout files, then design escape routing, via-in-pad or fanout structures, and assembly apertures from the controlled package documentation rather than distributor illustrations.
Budget the 950 mV to 1.05 V core range as a constraint rather than a single operating point. Confirm the exact VCCINT, VCCAUX, and other supply requirements, current limits, sequencing, and decoupling values from the complete manufacturer datasheet. Estimated power dissipation should be calculated from actual selected I/O loads, core utilization, clocking, and voltage drop; the supplied source set does not provide enough data for a defensible wattage estimate.
Place configuration, power-management, decoupling, and clock components according to the manufacturer's recommended reference design and pin-placement constraints. Preserve short return paths for high-speed interfaces and avoid routing sensitive signals through power or ground-plane discontinuities. Since the full 324-pin signal map is not included in the verified snippets, complete PCB review must use the official AMD ASCII or CSV package files before symbol and constraint generation.
Do not assume that sharing the CSG324 package makes every XC7A75T ordering code electrically interchangeable. The -1, -2, and -3 speed designations and the C, E, and I suffixes affect timing and temperature qualification. For any proposed replacement, compare the complete ordering tables, bitstream and configuration compatibility, I/O behavior, power characteristics, and timing margins before releasing a production BOM.
合规信息
The supplied verified web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance. These fields remain unknown rather than being inferred from the manufacturer or package family.
