XC7VX1140T-2FLG1928C - 1.14M Logic Cells Virtex-7 XT FPGA | AMD
料号： XC7VX1140T-2FLG1928C ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14038 | $14,038.00 |
| 10 | $13500 | $135,000.00 |
| 100 | $12800 | $1,280,000.00 |
| 500 | $11900 | $5,950,000.00 |
| 1,000 | $11000 | $11,000,000.00 |
XC7VX1140T-2FLG1928C 概述
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that lets designers configure its logic fabric and routing after fabrication, sitting at the top of the programmable logic taxonomy: programmable logic device -> CPLD -> FPGA -> high-end FPGA with embedded transceivers and DSP blocks. Virtex-7 T and XT devices extend the 7 series with multi-gigabit transceivers (MGTs) and high-speed parallel I/O for line-rate processing in wired telecom, defense, and test-and-measurement systems where ASIC lead times and NRE costs are prohibitive.
Key features of the XC7VX1140T-2FLG1928C include up to 36 GTX 13.1 Gb/s transceivers (family-level), up to 1,980 DSP48 slices, six PCIe Gen3 integrated blocks, advanced 28 Gb/s backplane support via the GTH/GTX mix, and hardened memory controllers. Programmable logic capacity of 1,139,200 cells and 89,000 CLBs makes it suitable for the largest signal-processing pipelines. The -2 commercial speed grade balances timing closure margin and throughput against quiescent power.
Architecturally, the device uses stacked silicon interconnect (SSI) technology in higher-density Virtex-7 devices, combining multiple super-logic regions (SLRs) on a passive interposer. This delivers higher usable logic density per die without the yield penalty of a monolithic 28 nm die. Hardened IP blocks offload PCIe, memory controller, and high-speed serial functions from the fabric, freeing DSP slices for application compute.
Typical applications include high-performance digital signal processing for radar and electronic warfare, 400G optical transport platforms, ASIC prototyping and emulation, high-frequency trading hardware, and medical imaging accelerators. The 480 user I/O in a 1928-ball FCBGA support dense parallel interfaces to external DDR4 memory and high-pin-count converters.
When designing with this part, allocate PCB layers and via-in-pad escape routing for the FCBGA, then validate signal integrity on MGT channels with IBIS-AMI models before committing to layout. Designers should consult the AMD Virtex-7 T and XT datasheet and UG473 for configuration and pinout guidance. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not all available in any single manufacturer document.
直接替换替代料： XC7VX1140T-2FLG1928C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
XC7VX1140T-1FLG1928C
✅ 直接替换📋 参考替代料（不在目录中）
XC7VX1140T-2FLG1928I
✅ 直接替换📋 参考替代料（不在目录中）
XC7VX1140T-3FLG1928C
✅ 直接替换📋 参考替代料（不在目录中）
XC7VX690T-2FLG1928C
✅ 直接替换📋 参考替代料（不在目录中）
XC7VX980T-2FLG1928C
✅ 直接替换📋 参考替代料（不在目录中）
XC7VX1140T-2FLG1928C 最大额定值与电气特性
| Family | Virtex-7 XT |
| Series | Virtex-7 T and XT |
| Logic Elements / Cells | 1,139,200 |
| Number of LABs / CLBs | 89,000 |
| Total RAM Bits | 69,304,320 |
| Number of User I/O | 480 |
| 封装 | 1928-ball FCBGA (FLG1928C) |
| Speed Grade | -2 (mid-speed) |
| Temperature Grade | Commercial (C) |
| Process Technology | 28 nm HKMG HPL |
| Core Voltage (VCCINT) | 1.0 V (typical for -2 speed grade) |
| 安装类型 | Surface Mount (FCBGA) |
| I/O Bandwidth (family) | Up to 1.4 Tb/s |
| DSP Performance (family) | Up to 4.7 TMACs/s |
| MSL 等级 | 4 (per JEDEC J-STD-020, FCBGA) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| 无卤 | Yes |
XC7VX1140T-2FLG1928C 引脚配置
| 引脚 Bank indices | Multiple I/O banks (HR/HP) — 1928-ball FCBGA with high-performance (HP) and high-range (HR) I/O banks per AMD UG475; per-ball pin names not enumerated due to package complexity and SSI super-logic region partitioning. Consult AMD Virtex-7 package pinout files for the FLG1928C device. |
典型应用
XC7VX1140T-2FLG1928C 适用于 6 应用s: 400G Optical Transport Line Cards, Radar and Electronic Warfare Signal Processing, ASIC Prototyping and Emulation, High-Frequency Trading (HFT) Hardware, Medical Imaging Accelerators, Test and Measurement Instrumentation.
400G Optical Transport Line Cards
The XC7VX1140T-2FLG1928C is well-matched to 400G optical transport line cards where OTU4 framer, FEC, and MAC processing must operate at line rate. The Virtex-7 XT fabric at 1,139,200 logic cells per AMD DS183 absorbs OTN framing, GFP mapping, and 400G PCS state machines concurrently. The 69 Mb on-chip block RAM buffers inter-lane skew compensation and FEC de-interleaving, avoiding off-chip memory round trips. Multi-gigabit transceivers support the CFP2/CFP4 host-side interfaces directly. Designers benefit from higher integration than smaller Virtex-7 T parts but should size SLR-to-SLR timing closure and verify reference clock jitter per AMD UG473.
推荐
Radar and Electronic Warfare Signal Processing
The XC7VX1140T-2FLG1928C's high DSP48 slice count and 69 Mb block RAM make it a strong fit for radar and electronic warfare systems where pulse compression, beamforming, and STAP must run in real time. Per AMD DS183 the Virtex-7 XT fabric sustains multi-GS/s sample-rate pipelines with thousands of complex FFT/iFFT cores in parallel. The 480 user I/O interface to multi-channel ADCs at JESD204B rates. The 1928-ball FCBGA exposes sufficient high-speed serial lanes for system synchronization and backhaul to a host processor. Trade-off: SSI SLR crossings may bound kernel throughput on very wide FFTs.
推荐
ASIC Prototyping and Emulation
ASIC prototyping and emulation harnesses the XC7VX1140T-2FLG1928C's 1.14M logic cell fabric to map large RTL designs partition-by-partition with predictable timing. AMD/Xilinx recommends Virtex-7 XT for multi-hundred-million-gate ASIC prototyping per DS183. The 480 user I/O expose wide chip-to-chip links between multiple FPGAs on a prototyping board. Designers use the Vivado Design Suite multi-FPGA partitioning flow with time-domain multiplexing. Considerations: FPGA-to-ASIC clock conversion (typically 5-10x), bring-up debug via Vivado ILA cores, and per-partition memory mapping into JTAGs are required.
推荐
High-Frequency Trading (HFT) Hardware
High-frequency trading platforms leverage the XC7VX1140T-2FLG1928C for nanosecond-scale market-data parsing, order-book matching, and risk-check pipelines where latency determinism dominates the design. Per AMD DS183 the Virtex-7 XT fabric supports fully pipelined feed handlers at 10G/25G line rates with deterministic latency via fixed routing. The 28 Gb/s capable transceivers handle the highest-speed market data feeds. Hardware designers lock critical paths with pipelining, register duplication, and Vivado physical optimization to meet sub-microsecond budget per AMD UG949.
推荐
Medical Imaging Accelerators
Medical imaging accelerators such as CT, MRI, and ultrasound reconstruction pipelines map directly onto the XC7VX1140T-2FLG1928C's 1.14M logic cells and DSP48 slice budget. Per AMD DS183 the Virtex-7 XT sustains real-time back-projection, filtered back-projection, and iterative reconstruction kernels with thousands of parallel multiply-accumulate paths. The PCIe Gen3 integrated block connects the FPGA to the host workstation as a coprocessor. Compared with a CPU/GPU baseline the FPGA delivers deterministic latency and lower power per image - critical for portable imaging carts and OR equipment.
推荐
Test and Measurement Instrumentation
Test and measurement instrumentation platforms such as high-end oscilloscopes, logic analyzers, and protocol testers deploy the XC7VX1140T-2FLG1928C for sample capture, triggering, and protocol decoding at multi-GS/s rates. Per AMD DS183 the Virtex-7 XT fabric and multi-gigabit transceivers process the captured stream in real time before sending compressed data to a host. The 69 Mb on-chip block RAM buffers pre-trigger capture windows. Key design consideration: high channel count drives PCB routing complexity; designers allocate 10+ routing layers with microvia escape for the FCBGA per AMD UG865.
推荐
推荐产品汇总
工程参考数据： XC7VX1140T-2FLG1928C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XC7VX1140T-1FLG1928C | XC7VX1140T-2FLG1928I | XC7VX1140T-3FLG1928C | XC7VX690T-2FLG1928C | XC7VX980T-2FLG1928C |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Package | 1928-ball FCBGA (FLG1928C) | 1928-ball FCBGA (FLG1928C) | 1928-ball FCBGA (FLG1928C) | 1928-ball FCBGA (FLG1928C) | 1928-ball FCBGA (FLG1928C) | 1928-ball FCBGA (FLG1928C) |
| Logic Cells | 1,139,200 | 1,139,200 | 1,139,200 | 1,139,200 | 693,120 | 979,200 |
| Speed Grade | -2 | -1 (faster) | -2 | -3 (slower) | -2 | -2 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) | Commercial (C) | Commercial (C) |
| Total Block RAM | 69,304,320 bits | 69,304,320 bits | 69,304,320 bits | 69,304,320 bits | 50,823,680 bits | 61,440,000 bits |
| User I/O | 480 | 480 | 480 | 480 | 480 | 480 |
| Transceivers | Up to 36 GTX (13.1 Gb/s) | Up to 36 GTX | Up to 36 GTX | Up to 36 GTX | Up to 36 GTX | Up to 36 GTX |
关键差异点
- Highest logic density in the Virtex-7 T family at the FLG1928C footprint （对比 XC7VX980T-2FLG1928C)
- Industrial temperature option for the same die and package （对比 XC7VX1140T-2FLG1928I)
- Mid-speed -2 grade for balanced timing margin and power （对比 XC7VX1140T-3FLG1928C)
设计说明
The 1928-ball FCBGA requires via-in-pad with microvia stackups. Recommended stackup is at least 12 layers with 0.4 mm pitch escape per AMD UG865. Use 1-2-1 microvia layer pairs under the package for BGA fanout and route high-speed serial lanes on stripline layers adjacent to solid reference planes. Estimated: based on standard FCBGA design rules for 1.0 mm ball pitch; verify with the specific Virtex-7 package pinout file.
At full fabric utilization with GTX transceivers active, the Virtex-7 XT 28 nm HKMG device dissipates 15-25 W typical. Design with a thermal management solution that keeps junction below 100 C, typically requiring a heatsink with 1-2 C/W thermal resistance plus 200-400 LFM airflow. AMD XPE thermal model provides per-design-case estimates. Estimated power range based on AMD DS183 typical values for the 1140T density tier.
GTX transceivers up to 13.1 Gb/s require matched-length routing, controlled differential impedance (100 ohm differential), and AC-coupling capacitors at transmitter output per AMD UG473. Reference clock jitter must remain below the line-rate budget; use a low-jitter clock synthesizer and route clocks on inner stripline layers with continuous reference planes.
Forgetting the SSI super-logic region (SLR) boundaries in the XC7VX1140T leads to timing closure failures on wide paths that cross SLR boundaries. AMD recommends using the Vivado floorplanning tools to map large kernels to a single SLR, and budgeting 2-3 ns additional delay for paths that must cross SLR boundaries via the interposer.
合规信息
RoHS and REACH compliance per AMD/Xilinx product environmental compliance information. AEC-Q100 not applicable (industrial/commercial grade); industrial (I) temperature variant XC7VX1140T-2FLG1928I is available for harsh-environment deployments.
