XCKU5P-2SFVB784E - 304 I/O Kintex UltraScale+ FPGA | AMD
料号： XCKU5P-2SFVB784E ✓ 量产中XCKU5P-2SFVB784E 概述
A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement logic, signal processing, control, and interface functions in parallel hardware. An FPGA combines configurable logic blocks, block RAM, programmable I/O, dedicated resources, and routing into one device. The Kintex UltraScale+ family is positioned for high-performance designs that require substantial parallel processing and flexible hardware adaptation.
The XCKU5P-2SFVB784E provides 474,600 logic elements distributed across 27,120 LABs/CLBs, with 41,984,000 bits of on-chip RAM for buffers, packet data, and intermediate processing. Its 304 user I/O pins support external connectivity, while the 784-BFBGA package provides the dense electrical interface required by a large FPGA. The product records list a supply range of 0.825 V to 0.876 V.
The -2 speed designation identifies the device grade, while SFVB784E identifies the package and ordering configuration. Designers should use the AMD UltraScale package pinout files and UG575 when assigning power, ground, configuration, clock, and user-I/O connections. Because the package contains 784 balls, power delivery and thermal management require a carefully designed multilayer PCB.
Typical applications include high-speed networking, industrial control, test and measurement, embedded vision, communications infrastructure, and digital signal processing. The large logic and memory footprint supports parallel datapaths, protocol handling, control logic, and accelerator-style architectures without requiring a custom ASIC.
When evaluating this FPGA, verify the complete ordering information, pinout, power requirements, configuration method, memory interfaces, and supported design tools against the AMD documentation. The package is not a simple low-pin-count component, so carrier-board compatibility and mechanical reworkability must be checked before substitution.
This product record combines the verified device identity, package and resource counts, lifecycle information, and practical implementation guidance with application context, sourcing instructions, and a pin-compatible replacement assessment.
直接替换替代料： XCKU5P-2SFVB784E ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
XCKU3P-2SFVB784E
✅ 直接替换联系询价
查看数据手册 →XCKU5P-2SFVB784E 最大额定值与电气特性
| Device Type | Kintex UltraScale+ FPGA |
| Logic Elements | 474,600 elements |
| Logic Cells | 27,120 LABs/CLBs |
| On-Chip RAM | 41,984,000 bits |
| User I/O | 304 pins |
| 封装 | 784-BFBGA, FCBGA |
| Package Type | FCBGA |
| 安装类型 | Surface mount |
| 电源电压 | 0.825 V to 0.876 V |
| Speed Grade | -2 |
| Programmable | Field programmable |
| Product Status | Active |
| Device Category | Embedded FPGAs |
| Terminal Count | 784 balls |
| Package Shape | Square |
| Form of Terminal | Ball |
XCKU5P-2SFVB784E square 引脚配置指南
XCKU5P-2SFVB784E（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XCKU5P-2SFVB784E.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XCKU5P-2SFVB784E 适用于 6 应用s: High-Speed Network Packet Processing, Industrial Control and Automation, Test and Measurement Instrumentation, Embedded Vision and Image Processing, Communications Infrastructure, Aerospace and Defense Digital Systems.
High-Speed Network Packet Processing
XCKU5P-2SFVB784E is appropriate for network devices requiring parallel packet classification, buffering, and protocol handling. Its 474,600 logic elements support substantial control and datapath concurrency, while 41,984,000 bits of on-chip RAM can hold packet windows, queues, and temporary payloads. The 304 user I/O provide connectivity for high-speed transceivers and control buses. A Kintex UltraScale+ board design must carefully allocate PLLs, clocking, serial links, and memory interfaces. The trade-off is substantial routing, power, and BGA-layout complexity compared with a smaller FPGA.
推荐
Industrial Control and Automation
The XCKU5P-2SFVB784E can implement deterministic industrial control logic alongside parallel signal processing because it combines 27,120 LABs/CLBs with 304 user I/O. Multiple machine-control channels can be handled in hardware, reducing dependence on a separate processor for timing-critical tasks. The large logic budget also supports motion control, diagnostics, and communication protocols. Engineers should reserve resources for clock generation, configuration startup, and fault recovery. Compared with XCKU3P-2SFVB784E, the target offers more design capacity for complex control fabrics and concurrent interfaces.
推荐
Test and Measurement Instrumentation
XCKU5P-2SFVB784E supports high-throughput acquisition, pattern generation, real-time analysis, and instrument control in a single programmable device. The 41,984,000 bits of block RAM provide local storage for samples and intermediate results, while the 474,600 logic elements support parallel processing channels. Its 304 user I/O simplify connection to converters, clock sources, and trigger systems. The design trade-off is demanding power and routing planning for a 784-BFBGA package, especially when multiple high-speed interfaces require simultaneous performance.
推荐
Embedded Vision and Image Processing
XCKU5P-2SFVB784E is suitable for embedded image pipelines that combine pixel acquisition, preprocessing, feature extraction, and control. Its large programmable logic capacity supports parallel lanes and fixed-function accelerator blocks without using a separate ASIC. The on-chip RAM can buffer line and tile data, while 304 user I/O provide sensor and display connectivity. For camera or surveillance equipment, clock-domain relationships and video timing become central layout considerations. The target offers more parallel capacity than XCKU3P-2SFVB784E, but also requires tighter thermal and power budgeting.
推荐
Communications Infrastructure
The 304 user I/O and substantial programmable fabric of XCKU5P-2SFVB784E make it appropriate for line-card, aggregation, and interface-conversion functions. Engineers can implement protocol termination, framing, traffic shaping, and monitoring in parallel hardware while using 41,984,000 RAM bits for packet buffering. The -2 speed grade supports performance-oriented timing targets, while the active lifecycle status supports long-term product planning. Its 784-ball package demands multilayer routing, dense power delivery, and signal-integrity validation for high-speed links.
推荐
Aerospace and Defense Digital Systems
XCKU5P-2SFVB784E can host parallel control, data-processing, and communication functions where FPGA programmability provides design flexibility across system variants. Its 474,600 logic elements and 41,984,000 bits of RAM support redundant datapaths and local buffering, while 304 user I/O enable dense external connectivity. Qualification status, radiation tolerance, operating-temperature range, and export-control requirements are not established in the product records and must be reviewed for the exact ordering code. The same-package XCKU3P alternative requires particularly careful resource and timing validation.
推荐
推荐产品汇总
工程参考数据： XCKU5P-2SFVB784E ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCKU3P-2SFVB784E |
|---|---|---|
| Brand | AMD | AMD |
| Package | 784-BFBGA, FCBGA | 784-BFBGA, FCBGA |
| FPGA Family | Kintex UltraScale+ | Kintex UltraScale+ |
| Speed Designator | -2 | -2 |
| Mounting Type | Surface mount | Surface mount |
关键差异点
- Larger documented programmable resource tier （对比 XCKU3P-2SFVB784E)
- High user-I/O capacity in the same package family （对比 XCKU3P-2SFVB784E)
- Documented -2 speed configuration （对比 XCKU3P-2SFVB784E)
设计说明
Treat the 784-BFBGA device as a multi-rail, high-current design and complete power budgeting before layout. The listed 0.825 V to 0.876 V range is the core supply range, not total board power. Assign separate regulation for core, auxiliary, configuration, and I/O requirements according to the AMD documentation. Place decoupling structures directly beneath the associated package balls, use via arrays wherever permitted by the pinout, and validate the PDN with a complete Vivado power report and board-level transient analysis.
Use the AMD UltraScale package pinout files as the authority for every one of the 784 balls. Separate high-speed transceiver, clock, memory, and general user-I/O routing into controlled topology classes, and preserve the recommended ball-escape paths for demanding interfaces. A dense FCBGA also needs careful component placement around the device to limit via stubs and maintain reflow access. Because the complete ball names are not reproduced in the product records, the manufacturer package file must be used during schematic capture and PCB release.
Model worst-case activity rather than average FPGA utilization when sizing the board thermal solution. Dense logic, high-speed I/O, and memory-intensive routing can raise junction temperature relative to a lightly loaded design. Provide copper thermal paths, spread high-power rails, and evaluate the package with the exact stack-up and airflow assumptions. Validate the final assembly using Vivado temperature estimates alongside chamber testing because board construction and heat-sink interface resistance strongly influence results.
Do not treat a shared package designation as proof that an FPGA is automatically interchangeable. XCKU3P-2SFVB784E uses the same documented 784-BFBGA format, but resource capacity and implementation results may differ. Require Vivado migration, utilization review, timing closure, I/O re-planning, and hardware testing before substitution. Also confirm configuration-boot behavior, clock topology, memory compatibility, and power sequencing; these system-level details can invalidate a package-only comparison.
合规信息
The product records identify the device as active but do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status.
