XCVU9P-2FLGA2104I - Virtex UltraScale+ FPGA | AMD/Xilinx
料号： XCVU9P-2FLGA2104I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7414 | $7,414.00 |
| 10 | $7043.3 | $70,433.00 |
| 100 | $6672.6 | $667,260.00 |
| 500 | $6301.9 | $3,150,950.00 |
| 1,000 | $5931.2 | $5,931,200.00 |
XCVU9P-2FLGA2104I 概述
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, memory, and interconnect are programmed after manufacturing. Within the semiconductor hierarchy, FPGAs sit alongside ASICs and ASSPs as core system logic devices, and the Virtex UltraScale+ family is AMD Xilinx's flagship programmable logic line for leading-edge compute, networking, and aerospace systems.
Key features include the 16nm FinFET UltraScale+ fabric, the -2 speed grade optimized for high clock frequencies, and 416 package I/O for wide external buses. The device's block RAM and UltraRAM resources (up to 270 Mb UltraRAM cited in application literature) support deep buffering for packet processing and machine learning pipelines.
Architecturally, the Virtex UltraScale+ family combines CLB logic, DSP48E2 slices, block RAM, UltraRAM, and GTY multi-gigabit transceivers (52 package GTY channels cited for this device) on a single die, enabling deterministic, low-latency implementations such as hardware trading paths and 5G fronthaul. The 2104-ball FCBGA packaging provides the power and signal integrity required at these data rates.
Typical applications include 5G wireless baseband, data center acceleration, AI inference, and low-latency financial trading, all of which exploit the fabric's parallelism and transceiver bandwidth. Industrial and aerospace systems also use the -I industrial temperature variant for extended thermal environments.
Design consideration: plan power distribution and decoupling for the multiple VCCINT/VCCO rails early, and use AMD Xilinx Vivado for synthesis and implementation - the -2I speed grade files are required for correct timing closure.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： XCVU9P-2FLGA2104I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
XCVU9P-2FLGB2104I
✅ 直接替换📋 参考替代料（不在目录中）
XCVU9P-2FLGA2104I4883
✅ 直接替换📋 参考替代料（不在目录中）
XCVU9P-L2FLGA2104E
✅ 直接替换📋 参考替代料（不在目录中）
XCVU9P-1FLGA2104I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCVU9P-2FLGA2104E
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
XCVU9P-2FLGA2104I 最大额定值与电气特性
| Manufacturer Series | Virtex UltraScale+ |
| Speed Grade | -2I (industrial) |
| Number of I/O | 416 |
| CLB Flip-Flops | 2586150 |
| Total Memory Bits (per DigiKey listing) | 391168000 |
| 封装 | 2104-BBGA, FCBGA (FLGA2104) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (industrial) |
| GTY Transceivers (package) | 52 (per application literature) |
| UltraRAM | 270 Mb (per application literature) |
| Design Software | AMD Xilinx Vivado |
XCVU9P-2FLGA2104I 52 (per application literature) 引脚配置指南
XCVU9P-2FLGA2104I（52 (per application literature) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： XCVU9P-2FLGA2104I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
XCVU9P-2FLGA2104I 适用于 6 应用s: 5G Wireless Baseband, Data Center Acceleration, Low-Latency Financial Trading, AI and Machine Learning Inference, Radar and Aerospace Signal Processing, ASIC Prototyping and Emulation.
5G Wireless Baseband
The XCVU9P-2FLGA2104I fits 5G baseband and fronthaul processing because its Virtex UltraScale+ fabric combines large parallel DSP capability with 416 user I/O and GTY multi-gigabit transceivers for eCPRI and fronthaul links. In a typical deployment, the FPGA terminates the fronthaul interface on GTY channels, performs digital up/down conversion, filtering, and beamforming weighting in DSP logic, and passes IQ samples at line rate with deterministic latency. The 3,911,680 Kb of listed memory capacity and 2,586,150 CLB flip-flops provide deep buffering for massive-MIMO scheduling. Because the -2I grade is rated -40C to +100C, it suits outdoor radio units and baseband units in telecom cabinets where temperature control is limited.
推荐
Data Center Acceleration
In data center compute acceleration, the XCVU9P-2FLGA2104I provides the logic density, memory bandwidth, and serial connectivity required for search, compression, database offload, and network processing. The 2,586,150 CLB flip-flops and large block RAM allow wide SIMD datapaths and deep pipeline buffering, while 270 Mb of UltraRAM cited in application literature supports large on-chip lookup tables and packet buffers. GTY transceivers connect directly to 100G+ Ethernet MACs implemented in fabric, giving the accelerator line-rate networking without a separate NIC. The -2 speed grade sustains high fabric clock frequencies for throughput-oriented designs. Because AMD provides Vitis and Vivado flows, software teams can deploy HLS-based kernels onto the fabric with standard driver stacks.
推荐
Low-Latency Financial Trading
Application literature (icallin, August 2026) specifically cites the XCVU9P-2FLGA2104I for deterministic low-latency trading, pairing 270 Mb UltraRAM and 52 package GTY channels with programmable logic to build deterministic trading paths where clocks, queues, and latency can be audited. In this application, market data is decoded directly on transceivers, normalized in fixed-latency pipelines, and order entries are generated in the same fabric with nanosecond-scale determinism - something CPU or GPU stacks cannot guarantee. The -2I industrial speed grade provides timing margin over commercial parts, and the FLGA2104 package maintains signal integrity for the GTY channels. Line-side monitoring and hardware timestamping are implemented alongside the trading path without adding latency.
推荐
AI and Machine Learning Inference
For AI inference at the edge of the data center, the XCVU9P-2FLGA2104I maps convolutional and transformer layers onto DSP48E2-based datapaths with wide block-RAM/UltraRAM buffering. The 2,586,150 CLB flip-flops and 3,911,680 Kb of listed memory capacity accommodate parallel weight staging and activation buffering, while high-frequency fabric clocks from the -2 speed grade deliver high effective throughput per watt for INT8/FP16 quantized networks. GTY transceivers stream input data and results over 100G-class links without host bottlenecking. The Vivado and Vitis AI toolchains provide quantized model compilation onto the fabric. Designs needing the highest ML throughput at similar power often step up to XCVU13P, while those needing ADC/DAC integration move to RFSoC devices.
推荐
Radar and Aerospace Signal Processing
The -I industrial temperature grade (-40C to +100C) makes the XCVU9P-2FLGA2104I appropriate for radar signal processing, electronic warfare prototyping, and avionics-adjacent industrial systems. Wide FFT, pulse compression, and CFAR detection chains map efficiently onto the UltraScale+ DSP fabric, while the 416 user I/O support high-speed LVDS data acquisition interfaces from ADC front ends. GTY transceivers move processed results over serial backplanes or fiber links. The 3,911,680 Kb listed memory capacity enables multi-pulse coherent processing buffers on chip. Design teams typically pair the FPGA with high-speed data converters and use partial reconfiguration to swap waveform-processing modes in the field without full reconfiguration downtime.
推荐
ASIC Prototyping and Emulation
The XCVU9P-2FLGA2104I serves ASIC and SoC prototyping because its large fabric can host multi-million-gate RTL designs at MHz-class emulation speeds far faster than software simulation. The 2,586,150 CLB flip-flops and 3,911,680 Kb of listed memory capacity map the ASIC's registers and memories into FPGA fabric, while 416 user I/O support multi-FPGA partitioning over GTY serial links between boards. The FLGA2104 package provides the ball count and thermal capability needed for continuous bench emulation runs. Debug uses Vivado integrated logic analyzers plus incremental compile flows to shorten the iterate-implement loop. Teams commonly use the -2 speed grade for maximum emulation clock frequency and retain the industrial -I grade for long unattended soak testing.
推荐
推荐产品汇总
工程参考数据： XCVU9P-2FLGA2104I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | XCVU9P-2FLGB2104I | XCVU9P-2FLGA2104I4883 | XCVU9P-L2FLGA2104E | XCVU9P-1FLGA2104I |
|---|---|---|---|---|---|
| Package | 2104-BBGA, FCBGA (FLGA2104) | 2104-BBGA, FCBGA (FLGB2104) - same footprint | 2104-BBGA, FCBGA - same | 2104-BBGA, FCBGA (FLGA2104) - same | 2104-BBGA, FCBGA (FLGA2104) - same |
| Brand | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) | AMD (Xilinx) |
| Speed Grade | -2I | -2I | -2I | -2LE | -1I |
| Power Optimization | Standard VCCINT operation | Standard VCCINT operation | Standard VCCINT operation | 0.72V VCCINT option for lower static power | Standard VCCINT operation |
关键差异点
- Performance-optimized -2I industrial speed grade （对比 XCVU9P-1FLGA2104I)
- Standard VCCINT operation for maximum performance （对比 XCVU9P-L2FLGA2104E)
- Deterministic low-latency hardware paths （对比 Intel Agilex (functional equivalent, non-drop-in))
设计说明
The FLGA2104 package requires a carefully planned power tree: VCCINT, VCCO banks, and auxiliary rails each need dedicated DC-DC converters with sequencing. Distribute hundreds of decoupling capacitors per the AMD Xilinx package-scale power estimation (shown in the UltraScale+ PCB design user guide) and use Vivado power estimation after synthesis to size rails. Estimated: even modest fabric utilization on a -2 grade device can draw tens of amps at VCCINT, so IR drop on the PCB planes must be budgeted before layout begins.
The 2104-ball FCBGA requires a controlled-impedance, microvia PCB with ball-out fanout matched to the AMD Xilinx FLGA2104 footprint (symbol and footprint available via SnapEDA). Follow the Xilinx UltraScale+ PCB Design User Guide for via-in-pad escape, back-drilling on GTY breakout, and plane splitting per I/O bank. The 416 user I/O span multiple VCCO banks - group interfaces by bank voltage during schematic capture to avoid re-spin.
Always select the -2I speed grade file in Vivado; implementing with a -2 or -2LE model produces invalid timing results because the -2LE device may run at a different VCCINT (0.72V vs 0.85V per the datasheet excerpt). Additionally, verify package designation (FLGA2104 vs FLGB2104) against the AMD package drawing before fabricating the board - the two share the ball count but the package drawing should be confirmed.
合规信息
Compliance data not present in the provided web data. AMD Xilinx FPGAs are typically RoHS-compliant but this must be confirmed from the official AMD product compliance documentation for this exact ordering code.
