10AS032H3F34I2LG vs 10AS032H2F34E2LG مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 10AS032H3F34I2LG بواسطة Intel و 10AS032H2F34E2LG بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | 10AS032H3F34I2LG | 10AS032H2F34E2LG |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| Maximum HPS Clock Frequency | 1.5 GHz | — |
| العلبة | 1152-FBGA, FC (35x35 mm) | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Pin/Ball Count | 1152 | — |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Square | — |
| Operating Temperature Grade | Industrial | — |
| Temperature Range | -40C to +100C (junction, per industrial grade) | — |
| Process Node | 20 nm (Arria 10 generation) | 20 nm |
| Device Designator | 10AS032H3F34I2LG | — |
| Speed Grade | 2 | 2 |
| Lead-Free / RoHS | Yes (LG suffix) | — |
| Packaging Form | Tray (LG suffix) | — |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| DSP Blocks | — | Variable-precision, IEEE 754 single-precision FP support |
| Transceivers | — | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| حالة RoHS | — | Compliant |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |