10AS032H3F34I2LG vs 10AS032H2F34E2LG Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10AS032H3F34I2LG sa pamamagitan ng Intel at 10AS032H2F34E2LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10AS032H3F34I2LG 10AS032H2F34E2LG
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria 10 SX SoC FPGA Arria 10 SX
Logic Elements 320,000 320,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
Maximum HPS Clock Frequency 1.5 GHz —
Packhaging 1152-FBGA, FC (35x35 mm) 1152-ball FC-FBGA (F34), 35 x 35 mm
Pin/Ball Count 1152 —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Terminal Form Ball —
Package Code BGA —
Package Shape Square —
Operating Temperature Grade Industrial —
Temperature Range -40C to +100C (junction, per industrial grade) —
Process Node 20 nm (Arria 10 generation) 20 nm
Device Designator 10AS032H3F34I2LG —
Speed Grade 2 2
Lead-Free / RoHS Yes (LG suffix) —
Packaging Form Tray (LG suffix) —
Device Tier — 10AS032 (mid-density)
Configuration — SoC FPGA (HPS + FPGA fabric)
Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Operating Frequency — 1.5 GHz
Temperature Grade — E2 (commercial/extended)
On-chip Memory (M20K blocks) — Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet]
DSP Blocks — Variable-precision, IEEE 754 single-precision FP support
Transceivers — Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package]
Memory Controller Hard IP — DDR4, DDR3, QDRII+, RLDRAM3
Tindminan RoHS — Compliant
Form of Terminal — Ball (BGA)
Terminal Pitch — 1 mm

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