10M04SCU324C8G vs 10M04DAU324C8G مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ 10M04SCU324C8G بواسطة Intel و 10M04DAU324C8G بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | 10M04SCU324C8G | 10M04DAU324C8G |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 4,000 | — |
| Embedded Memory (M9K) | 246 Kbits (193,536 RAM bits total) | — |
| Embedded Block RAM Blocks | M9K × N | — |
| Process Technology | 55 nm CMOS | — |
| Core Voltage (VCCINT) | 1.2 V (typical) | — |
| Configuration Memory | Internal dual-configuration flash (non-volatile) | — |
| Maximum User I/O | [DATA_NEEDED: exact count per U324 package] | 246 |
| العلبة | 324-LFBGA (UBGA), 15 mm × 15 mm | 324-LFBGA |
| Temperature Grade | Commercial (0 °C to 85 °C junction) | — |
| Speed Grade | C8 | C8G |
| ADC Blocks | 12-bit successive-approximation (MAX 10 family feature) | — |
| DSP Blocks | Yes (18 × 18 multipliers) | — |
| User Flash Memory | Yes (MAX 10 family feature) | — |
| PLLs | Yes (peripheral and general-purpose) | — |
| نوع التركيب | Surface Mount (BGA) | Surface Mount |
| حالة RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 4,000 |
| Embedded Memory | — | 193,536 bits |
| User I/O | — | 246 |
| Package Code | — | U324 |
| Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Ordering Part Number | — | 10M04DAU324C8G |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| درجة حرارة التشغيل | — | [DATA_NEEDED: operating temperature range] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| I/O Standard Support | — | [DATA_NEEDED: I/O standard support] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Timing Performance | — | [DATA_NEEDED: timing performance] |
| Embedded Multiplier Count | — | [DATA_NEEDED: embedded multiplier count] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Ball Grid Package | — | 324 balls |
| Device Manufacturer | — | Intel / Altera |