10M04SCU324C8G vs 10M04DAU324C8G Perbandingan
Perbandingan bersamaan detil 10M04SCU324C8G dari Intel dan 10M04DAU324C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M04SCU324C8G | 10M04DAU324C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 4,000 | — |
| Embedded Memory (M9K) | 246 Kbits (193,536 RAM bits total) | — |
| Embedded Block RAM Blocks | M9K × N | — |
| Process Technology | 55 nm CMOS | — |
| Core Voltage (VCCINT) | 1.2 V (typical) | — |
| Configuration Memory | Internal dual-configuration flash (non-volatile) | — |
| Maximum User I/O | [DATA_NEEDED: exact count per U324 package] | 246 |
| Paket | 324-LFBGA (UBGA), 15 mm × 15 mm | 324-LFBGA |
| Temperature Grade | Commercial (0 °C to 85 °C junction) | — |
| Speed Grade | C8 | C8G |
| ADC Blocks | 12-bit successive-approximation (MAX 10 family feature) | — |
| DSP Blocks | Yes (18 × 18 multipliers) | — |
| User Flash Memory | Yes (MAX 10 family feature) | — |
| PLLs | Yes (peripheral and general-purpose) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Elements | — | 4,000 |
| Embedded Memory | — | 193,536 bits |
| User I/O | — | 246 |
| Package Code | — | U324 |
| Technology | — | 55 nm |
| Core Voltage | — | 1.2 V |
| Ordering Part Number | — | 10M04DAU324C8G |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Configuration Method | — | [DATA_NEEDED: configuration method] |
| I/O Standard Support | — | [DATA_NEEDED: I/O standard support] |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Timing Performance | — | [DATA_NEEDED: timing performance] |
| Embedded Multiplier Count | — | [DATA_NEEDED: embedded multiplier count] |
| Transceiver Count | — | [DATA_NEEDED: transceiver count] |
| Ball Grid Package | — | 324 balls |
| Device Manufacturer | — | Intel / Altera |