A3P600-FGG484 vs A3PE600-FGG484 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600-FGG484 بواسطة Microchip Technology و A3PE600-FGG484 بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ نشطمقارنة المواصفات
| المعامل | A3P600-FGG484 | A3PE600-FGG484 |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3 | ProASIC3E |
| System Gates | 600K | 600000 |
| Maximum System Frequency | 231 MHz | 350 MHz |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 235 | — |
| العلبة | 484-Pin FBGA (FGG484) | FBGA-484 (PBGA484) |
| نوع التركيب | Surface Mount | — |
| Configuration Memory | Flash-based (non-volatile, single chip) | On-chip flash (non-volatile, live at power-up) |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| حالة RoHS | Lead Free | Green / [DATA_NEEDED: RoHS compliance detail] |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| نمط التركيب | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Number of Pins / Balls | — | 484 |