A3P600-FGG484 vs A3PE600-FGG484 비교
다음의 상세 나란히 비교: A3P600-FGG484 제조: Microchip Technology 및 A3PE600-FGG484 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ 활성사양 비교
| 파라미터 | A3P600-FGG484 | A3PE600-FGG484 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $44.75 | $53.70 |
| Family | ProASIC3 | ProASIC3E |
| System Gates | 600K | 600000 |
| Maximum System Frequency | 231 MHz | 350 MHz |
| Process Technology | 130 nm CMOS | 130 nm CMOS flash |
| Core Supply Voltage | 1.5 V | — |
| User I/O Count | 235 | — |
| 패키지 | 484-Pin FBGA (FGG484) | FBGA-484 (PBGA484) |
| 실장 유형 | Surface Mount | — |
| Configuration Memory | Flash-based (non-volatile, single chip) | On-chip flash (non-volatile, live at power-up) |
| Terminal Form | Ball | — |
| Package Shape | Square BGA | — |
| Temperature Grade | Commercial | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Operating Temperature Minimum | 0 C | — |
| Operating Temperature Maximum | [DATA_NEEDED: maximum operating temperature] | — |
| RoHS 상태 | Lead Free | Green / [DATA_NEEDED: RoHS compliance detail] |
| Number of Logic Elements (LEs) | [DATA_NEEDED: logic element count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| 장착 스타일 | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Number of Pins / Balls | — | 484 |