A3P600L-FGG484 vs A3P600-FGG484 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3P600L-FGG484 بواسطة Microchip Technology و A3P600-FGG484 بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | A3P600L-FGG484 | A3P600-FGG484 |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3L | ProASIC3 |
| Equivalent Gates | 600000 gates | — |
| Logic Cells / CLBs | 13824 | — |
| User I/O | 235 | — |
| Maximum System Frequency | 350 MHz | 231 MHz |
| Core Voltage | 1.2 V (1.2 V to 1.5 V supported) | — |
| Technology | 130 nm CMOS flash | — |
| Configuration Memory | On-chip flash (non-volatile, single chip) | Flash-based (non-volatile, single chip) |
| العلبة | FBGA-484 (PBGA484) | 484-Pin FBGA (FGG484) |
| Package Dimensions | 23 x 23 mm | — |
| Package Height | 2.23 mm | — |
| Ball Pitch | 1 mm | — |
| نوع التركيب | Surface Mount | Surface Mount |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | — |
| Soft Processor Support | ARM Cortex-M1 | — |
| حالة RoHS | Green (RoHS compliant per Jotrin listing) | Lead Free |
| Speed Grade Suffix | Standard (no dash number in this ordering code) | — |
| System Gates | — | 600K |
| Process Technology | — | 130 nm CMOS |
| Core Supply Voltage | — | 1.5 V |
| User I/O Count | — | 235 |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |