A3PE3000L-1FGG896 vs A3PE3000L-FG896I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ A3PE3000L-1FGG896 بواسطة Microchip Technology و A3PE3000L-FG896I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ نشطMicrochip Technology
A3PE3000L-FG896I - ProASIC3L Flash FPGA 620 I/O | Microchip
A3PE3000L-FG896I ✓ نشطمقارنة المواصفات
| المعامل | A3PE3000L-1FGG896 | A3PE3000L-FG896I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | ProASIC3L | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | 75264 |
| User I/O | 620 | 620 |
| Total Bits of RAM | [DATA_NEEDED: Total embedded RAM bits] | — |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | 1.2 V to 1.5 V |
| I/O Voltage | As low as 1.2 V | — |
| Speed Grade | -1 | [DATA_NEEDED: speed grade / grade code] |
| Process Technology | 130 nm flash | — |
| Configuration Memory | Nonvolatile flash (single-chip) | On-chip Flash (single-chip, nonvolatile) |
| Special Features | Flash*Freeze technology | — |
| العلبة | 896-ball FBGA (FGG896), 1.00 mm pitch | 896-BGA (FBGA-896) |
| نوع التركيب | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Terminal Pitch | 1.00 mm | — |
| Technology Base | CMOS flash | — |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% | — |
| Static Power Reduction vs ProASIC3 | Approx. 50% | — |
| I/O Voltage (minimum) | — | 1.2 V |
| Low Power Feature | — | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| Temperature Grade | — | Industrial (-I suffix) |
| Reprogrammability | — | Yes (in-system reprogrammable) |
| حالة RoHS | — | RoHS Non-Compliant (per distributor listing) |
| Lead Free Status | — | Contains Lead (per distributor listing) |
| نطاق درجة حرارة التشغيل | — | [DATA_NEEDED: exact operating temperature range in C] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM block capacity] |