ATREB215-XPRO vs ATSAMB11ZR-XPRO مقارنة

مقارنة تفصيلية جنبًا إلى جنب لـ ATREB215-XPRO بواسطة Microchip Technology و ATSAMB11ZR-XPRO بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.

Microchip Technology
ATREB215-XPRO ATREB215-XPRO - AT86RF215 Dual-Band RF Eval Board | Microchip

ATREB215-XPRO - AT86RF215 Dual-Band RF Eval Board | Microchip

ATREB215-XPRO ✓ نشط
Microchip Technology
ATSAMB11ZR-XPRO ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip

ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip

ATSAMB11ZR-XPRO ✓ نشط

مقارنة المواصفات

المعامل ATREB215-XPRO ATSAMB11ZR-XPRO
العلامة التجارية Microchip Technology Microchip Technology
الفئة Development Boards Wireless Modules
حالة دورة الحياة نشط نشط
Product Type Xplained Pro RF Extension Board RF Evaluation and Development Kit
Mounted Transceiver AT86RF215 —
Frequency Bands Sub-1 GHz (700/800/900 MHz) and 2.4 GHz ISM —
Radio Standard IEEE 802.15.4 / 802.15.4-2011 PHY —
Host Interface Xplained Pro EXT header (EXT1 target, compatible with all XPRO EXT headers) —
Control Interface SPI (AT86RF215 slave) plus GPIOs —
Sub-1 GHz RF Matching muRata DLW21SN900SQ2 balun (RFP09/RFN09 differential to single-ended) —
Supported Host Kits SAM4L Xplained Pro, SAMG55 Xplained Pro, and other Xplained Pro kits —
Board Revision Family ATREB215-XPRO and ATREB215-XPRO-A —
Category (DigiKey) RF & Wireless > Evaluation Boards - RF —
Typical Use Evaluation of AT86RF215 transceiver PHY performance —
Operating Supply [DATA_NEEDED: supply voltage via XPRO header] —
Board Dimensions [DATA_NEEDED: board dimensions] —
Antenna Connector [DATA_NEEDED: antenna connector type] —
حالة RoHS Lead free / RoHS Compliant Compliant
درجة حرارة التشغيل [DATA_NEEDED: operating temperature range] -40C to +85C
Base Part Number — ATSAMB11-ZR210CA
RF Technology — Bluetooth Smart 4.x Low Energy (BLE)
Operating Frequency — 2.4 GHz ISM band
Module Family — SmartConnect (ATSAMB11 Series)
Module Type — SiP/Module (System-in-Package)
Supported Standards — IEEE 802.15.1, Bluetooth 4.x Low Energy
Host Processor — ARM Cortex-M0
Integrated Crystal — 32.768 kHz RTC + 16 MHz main
Power Supply — USB powered via on-board debugger
Debug Interface — On-board SWD + Virtual COM port over USB
Extension Connectors — Xplained Pro header + mikroBUS socket
User Interface — 1x user pushbutton, 1x user LED, QT touch header
Country of Origin — RoHS-compliant Microchip packaging

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