ATREB215-XPRO vs ATSAMB11ZR-XPRO 비교
다음의 상세 나란히 비교: ATREB215-XPRO 제조: Microchip Technology 및 ATSAMB11ZR-XPRO 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
ATREB215-XPRO - AT86RF215 Dual-Band RF Eval Board | Microchip
ATREB215-XPRO ✓ 활성Microchip Technology
ATSAMB11ZR-XPRO - BLE 4.x SmartConnect Xplained Pro | Microchip
ATSAMB11ZR-XPRO ✓ 활성사양 비교
| 파라미터 | ATREB215-XPRO | ATSAMB11ZR-XPRO |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | Development Boards | Wireless Modules |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $83.63 | $45.00 |
| Product Type | Xplained Pro RF Extension Board | RF Evaluation and Development Kit |
| Mounted Transceiver | AT86RF215 | — |
| Frequency Bands | Sub-1 GHz (700/800/900 MHz) and 2.4 GHz ISM | — |
| Radio Standard | IEEE 802.15.4 / 802.15.4-2011 PHY | — |
| Host Interface | Xplained Pro EXT header (EXT1 target, compatible with all XPRO EXT headers) | — |
| Control Interface | SPI (AT86RF215 slave) plus GPIOs | — |
| Sub-1 GHz RF Matching | muRata DLW21SN900SQ2 balun (RFP09/RFN09 differential to single-ended) | — |
| Supported Host Kits | SAM4L Xplained Pro, SAMG55 Xplained Pro, and other Xplained Pro kits | — |
| Board Revision Family | ATREB215-XPRO and ATREB215-XPRO-A | — |
| Category (DigiKey) | RF & Wireless > Evaluation Boards - RF | — |
| Typical Use | Evaluation of AT86RF215 transceiver PHY performance | — |
| Operating Supply | [DATA_NEEDED: supply voltage via XPRO header] | — |
| Board Dimensions | [DATA_NEEDED: board dimensions] | — |
| Antenna Connector | [DATA_NEEDED: antenna connector type] | — |
| RoHS 상태 | Lead free / RoHS Compliant | Compliant |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | -40C to +85C |
| Base Part Number | — | ATSAMB11-ZR210CA |
| RF Technology | — | Bluetooth Smart 4.x Low Energy (BLE) |
| Operating Frequency | — | 2.4 GHz ISM band |
| Module Family | — | SmartConnect (ATSAMB11 Series) |
| Module Type | — | SiP/Module (System-in-Package) |
| Supported Standards | — | IEEE 802.15.1, Bluetooth 4.x Low Energy |
| Host Processor | — | ARM Cortex-M0 |
| Integrated Crystal | — | 32.768 kHz RTC + 16 MHz main |
| Power Supply | — | USB powered via on-board debugger |
| Debug Interface | — | On-board SWD + Virtual COM port over USB |
| Extension Connectors | — | Xplained Pro header + mikroBUS socket |
| User Interface | — | 1x user pushbutton, 1x user LED, QT touch header |
| Country of Origin | — | RoHS-compliant Microchip packaging |