DSP56321VL220557 vs DSP56321VL220 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ DSP56321VL220557 بواسطة NXP Semiconductors و DSP56321VL220 بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | DSP56321VL220557 | DSP56321VL220 |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | DSP | DSP |
| حالة دورة الحياة | نشط | NRND |
| Product Type | Digital Signal Processor (DSP) | — |
| Architecture | 24-bit fixed-point DSP56300 family | — |
| Core Clock Frequency | 220 MHz | 220 MHz |
| Instruction Cycle Time | 15 ns | — |
| Data Word Width | 24-bit | — |
| Accumulator Width | 56-bit | — |
| On-chip Memory | Program ROM/RAM and Data RAM (see datasheet) | — |
| DMA Channels | 4 independent channels | 6 |
| DMA Controller | Yes | — |
| External Memory Interface | Yes (SRAM / DRAM expansion) | — |
| Enhanced Filter Co-Processor | EFCOP for sample-rate conversion | — |
| Host Interface | Asynchronous serial / parallel ports | Serial Host Interface (SHI) + Host Port |
| Serial Audio Interface | Yes (ESSI / SCI) | — |
| Timers | Triple timer module | Triple Timer module |
| نطاق درجة حرارة التشغيل | -40C to +85C (industrial) | — |
| I/O Logic Level | TTL-compatible | — |
| Process Technology | High-density CMOS | — |
| العلبة | MAPBGA-196 (15x15 mm) | 196-ball MAPBGA (15 x 15 mm) |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| حالة RoHS | Compliant | — |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Instruction Throughput | — | 220 MIPS |
| Internal Core Voltage | — | 1.8 V |
| I/O Voltage | — | 3.3 V |
| Program Address Space | — | 16M x 24-bit words |
| Data Address Space (X/Y) | — | 16M x 24-bit words (each) |
| On-chip Program RAM | — | [DATA_NEEDED: program RAM size in words] |
| On-chip Data RAM | — | [DATA_NEEDED: X/Y data RAM size in words] |
| Instruction Cache | — | Yes (configurable) |
| Audio Interface | — | Enhanced Serial Audio Interface (ESAI) |
| Communication Interface | — | Serial Communication Interface (SCI) |
| Bootstrap ROM | — | Yes (flashless boot) |
| درجة حرارة التشغيل | — | [DATA_NEEDED: operating temperature range] |
| Lead Free / RoHS | — | Lead-free (PBFREE), RoHS compliant |