EP1AGX50CF484I6 vs EP1AGX50CF484C4 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP1AGX50CF484I6 بواسطة Intel و EP1AGX50CF484C4 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP1AGX50CF484I6 | EP1AGX50CF484C4 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | Obsolete | Obsolete |
| Family | Arria GX | Arria GX |
| Logic Elements (LEs) | 50160 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: typical VCCINT] |
| العلبة | 484-ball FBGA (FC-FBGA), 1.0 mm pitch | 484-pin FineLine BGA (FBGA-484) |
| Package Code | S-PBGA-B484 | — |
| Maximum User I/O | 229 | — |
| Number of Terminals | 484 | — |
| Package Shape | Square | — |
| Embedded Memory | 2475072 bits | [DATA_NEEDED: total bits] |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Count | Up to 12 (3.125 Gbps) | [DATA_NEEDED: number of transceivers on this device] |
| Speed Grade | I6 (industrial) | — |
| نطاق درجة حرارة التشغيل | -40C to +100C (industrial) | — |
| Configuration Scheme | Passive serial, passive parallel, JTAG | — |
| PLL Count | Up to 8 | [DATA_NEEDED: count] |
| حالة RoHS | Compliant | [DATA_NEEDED: RoHS compliance per data] |
| مستوى MSL | 3 | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Body Material | Plastic / Epoxy | — |
| Logic Elements (LE) | — | [DATA_NEEDED: Logic Elements count for EP1AGX50] |
| Temperature Grade | — | Commercial (C) |
| Device Variant Suffix | — | C4 (speed grade 4, commercial) |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Multipliers (18x18) | — | [DATA_NEEDED: count] |
| User I/O Pins | — | [DATA_NEEDED: user I/O count for CF484] |
| Process Node | — | 90 nm |
| حالة دورة الحياة | — | Obsolete / last-time-buy per industry reports |