EP1AGX50CF484I6 vs EP1AGX50CF484C4 Perbandingan
Perbandingan bersamaan detil EP1AGX50CF484I6 dari Intel dan EP1AGX50CF484C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1AGX50CF484I6 | EP1AGX50CF484C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Arria GX | Arria GX |
| Logic Elements (LEs) | 50160 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | [DATA_NEEDED: typical VCCINT] |
| Paket | 484-ball FBGA (FC-FBGA), 1.0 mm pitch | 484-pin FineLine BGA (FBGA-484) |
| Package Code | S-PBGA-B484 | — |
| Maximum User I/O | 229 | — |
| Number of Terminals | 484 | — |
| Package Shape | Square | — |
| Embedded Memory | 2475072 bits | [DATA_NEEDED: total bits] |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Count | Up to 12 (3.125 Gbps) | [DATA_NEEDED: number of transceivers on this device] |
| Speed Grade | I6 (industrial) | — |
| Rentang Suhu Kerja | -40C to +100C (industrial) | — |
| Configuration Scheme | Passive serial, passive parallel, JTAG | — |
| PLL Count | Up to 8 | [DATA_NEEDED: count] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS compliance per data] |
| Level MSL | 3 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Body Material | Plastic / Epoxy | — |
| Logic Elements (LE) | — | [DATA_NEEDED: Logic Elements count for EP1AGX50] |
| Temperature Grade | — | Commercial (C) |
| Device Variant Suffix | — | C4 (speed grade 4, commercial) |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| Multipliers (18x18) | — | [DATA_NEEDED: count] |
| User I/O Pins | — | [DATA_NEEDED: user I/O count for CF484] |
| Process Node | — | 90 nm |
| Status Lingkungan Hidup | — | Obsolete / last-time-buy per industry reports |