EP2AGX45DF29C4N vs EP2AGX45DF29C6G مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2AGX45DF29C4N بواسطة Intel و EP2AGX45DF29C6G بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2AGX45DF29C4N | EP2AGX45DF29C6G |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | NRND |
| Series | Arria II GX | Arria II GX |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | 45,000 |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | C6 (commercial, mid-speed) |
| Temperature Range | 0C to +85C (commercial) | — |
| العلبة | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| نوع التركيب | Surface Mount | Surface Mount (BGA) |
| مستوى MSL | 3 | 3 (168 hours) |
| حالة RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Intel FPGA (formerly Altera) |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| DSP 18x18 Multipliers | — | 312 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Process Node | — | 40 nm TSMC low-power |
| درجة حرارة التشغيل | — | 0C to +85C (commercial) |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | — | SRAM-based, volatile |