EP2AGX45DF29C4N vs EP2AGX45DF29C6G तुलना
विस्तृत दोनों ओर की तुलना EP2AGX45DF29C4N द्वारा Intel और EP2AGX45DF29C6G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP2AGX45DF29C4N | EP2AGX45DF29C6G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Series | Arria II GX | Arria II GX |
| Device Family | Arria II GX FPGA | — |
| Logic Elements (LE) | 42,959 | 45,000 |
| Number of LABs | 1805 | — |
| Embedded Memory (Bits) | 3,517,440 | — |
| M9K Memory Blocks | 1541 Kbits | — |
| MLAB Memory | 656 Kbits (configurable as LEs) | — |
| DSP Blocks (18x18 Multipliers) | 232 | — |
| Number of Transceivers | 8 channels | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Maximum User I/O | 364 | — |
| PLL Count | 8 (4 enhanced + 4 fast) | — |
| Global Clock Networks | Up to 16 | — |
| Process Technology | 40 nm TSMC | — |
| Core Voltage (VCC) | 1.1 V | — |
| Auxiliary Supply (VCCPT) | 0.9 V | — |
| Speed Grade | C4 (commercial, mid-speed) | C6 (commercial, mid-speed) |
| Temperature Range | 0C to +85C (commercial) | — |
| पैकेज | 780-ball FBGA (FineLine BGA, 29x29 mm) | 780-FBGA (29x29 mm, 1.0 mm pitch) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| MSL स्तर | 3 | 3 (168 hours) |
| RoHS स्थिति | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Intel FPGA (formerly Altera) |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| DSP 18x18 Multipliers | — | 312 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Process Node | — | 40 nm TSMC low-power |
| ऑपरेटिंग तापमान | — | 0C to +85C (commercial) |
| Hard IP Blocks | — | PCIe Gen1/Gen2, External Memory Controller |
| Configuration | — | SRAM-based, volatile |