EP2SGX30CF780C6 vs EP2SGX30CF780C4 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2SGX30CF780C6 بواسطة Intel و EP2SGX30CF780C4 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2SGX30CF780C6 | EP2SGX30CF780C4 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | 1,369,728 |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| العلبة | 780-ball FineLine BGA (F780) | 780-BBGA (flip-chip) |
| Speed Grade | C6 (commercial, mid-speed) | — |
| درجة حرارة التشغيل | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements | — | 33,880 |
| Maximum User I/Os | — | 361 |
| LABs/CLBs | — | 1,694 |
| Maximum Operating Frequency | — | 732.1 MHz |
| Core Supply Voltage | — | 1.2 V |
| نوع التركيب | — | Surface Mount |
| AEC-Q100 | — | Not applicable (FPGA, commercial/industrial) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Yes (Stratix II GX integrated) |
| مستوى MSL | — | [DATA_NEEDED: MSL level] |