EP2SGX30CF780C6 vs EP2SGX30CF780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C6 sa pamamagitan ng Intel at EP2SGX30CF780C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX30CF780C6 | EP2SGX30CF780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | 1,369,728 |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Packhaging | 780-ball FineLine BGA (F780) | 780-BBGA (flip-chip) |
| Speed Grade | C6 (commercial, mid-speed) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements | — | 33,880 |
| Maximum User I/Os | — | 361 |
| LABs/CLBs | — | 1,694 |
| Maximum Operating Frequency | — | 732.1 MHz |
| Core Supply Voltage | — | 1.2 V |
| Uri ng Pagpapasok | — | Surface Mount |
| AEC-Q100 | — | Not applicable (FPGA, commercial/industrial) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Transceivers | — | Yes (Stratix II GX integrated) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |