EP2SGX30CF780C7 vs EP2SGX30CF780C3N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2SGX30CF780C7 بواسطة Intel و EP2SGX30CF780C3N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2SGX30CF780C7 | EP2SGX30CF780C3N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | Obsolete |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 33,000 | — |
| Embedded Memory | 1.9 Mbits | TriMatrix (M512/M4K/M-RAM blocks) |
| DSP Blocks (18x18 multipliers) | 256 | — |
| Maximum User I/O | 361 | — |
| Multi-Gigabit Transceivers | 4 channels | — |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps | — |
| PLLs | 4 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| العلبة | 780-ball FineLine BGA (CF780) | — |
| Ball Pitch | 1.0 mm | — |
| Speed Grade | C7 (fastest commercial) | — |
| درجة حرارة التشغيل | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, Passive Parallel Asynchronous, JTAG | PS, FPP, JTAG |
| حالة RoHS | Compliant (lead-free Fineline BGA) | [DATA_NEEDED: not stated in retrieved web snippets] |
| Number of Logic Elements | — | 33,880 |
| Number of CLBs | — | 33,880 |
| Maximum Operating Frequency | — | 717 MHz |
| عدد الدبابيس | — | 780 |
| Package Type | — | 780-BGA (FC-FBGA) |
| نوع التركيب | — | Surface Mount |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count per family datasheet] |
| Total Embedded RAM | — | ~1.4 Mbit |
| DSP Blocks | — | 18-bit x 18-bit dedicated multipliers |
| Number of User I/O | — | [DATA_NEEDED: pin count varies by package; ~600 typical for 780-BGA] |
| Lead-Free | — | [DATA_NEEDED: not stated in retrieved web snippets] |
| Supply Voltage Range | — | [DATA_NEEDED: full VTT/VCCIO not stated in retrieved web snippets] |