EP3SE110F780C3N vs EP3SE110F780I3N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3SE110F780C3N بواسطة Intel و EP3SE110F780I3N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N Nrndمقارنة المواصفات
| المعامل | EP3SE110F780C3N | EP3SE110F780I3N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | 8,936,448 (approximately 1.1 MB) |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| User I/Os | 488 | — |
| العلبة | 780-ball FCBGA (Flip-Chip BGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Core Voltage | 1.1 V | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| حالة RoHS | Compliant | Compliant |
| نوع التركيب | Surface Mount (BGA) | Surface Mount (BGA) |
| مستوى MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Logic Elements | — | 107,500 |
| Maximum User I/Os | — | 488 |
| درجة حرارة التشغيل | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |