EP3SE110F780C3N vs EP3SE110F780I3N तुलना
विस्तृत दोनों ओर की तुलना EP3SE110F780C3N द्वारा Intel और EP3SE110F780I3N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N Nrndविशेषता तुलना
| पैरामीटर | EP3SE110F780C3N | EP3SE110F780I3N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LEs) | 107,500 | — |
| Embedded Memory Bits | 8,936,448 | 8,936,448 (approximately 1.1 MB) |
| Logic Array Blocks (LABs) | 4,300 | 4,300 |
| User I/Os | 488 | — |
| पैकेज | 780-ball FCBGA (Flip-Chip BGA) | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Core Voltage | 1.1 V | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Operating Frequency | 500 MHz | — |
| DSP Blocks | Yes (integrated, count varies by configuration) | — |
| Transceiver Channels | 8 (multi-gigabit) | — |
| Embedded Memory | TriMatrix (MLAB + M9K + M144K) | — |
| Configuration Method | Serial / Parallel via Quartus II | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| RoHS स्थिति | Compliant | Compliant |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| MSL स्तर | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Logic Elements | — | 107,500 |
| Maximum User I/Os | — | 488 |
| ऑपरेटिंग तापमान | — | -40 °C to +100 °C (Industrial, "I" grade) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| Speed Grade | — | 3 (Fast) |
| PLLs | — | Yes, with global and regional clock networks |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |