EP3SE50F484I3 vs EP3SE50F484I3N مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP3SE50F484I3 بواسطة Intel و EP3SE50F484I3N بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP3SE50F484I3 | EP3SE50F484I3N |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory | 5,760 Kbits | — |
| User I/Os | 296 | — |
| Process Technology | 65 nm | 65 nm |
| Core Voltage | 1.1 V | — |
| العلبة | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-pin FC-FBGA (flip-chip BGA) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | I3 (industrial, bin 3) |
| DSP Blocks | Yes (embedded multipliers and accumulators) | [DATA_NEEDED: number of DSP blocks] |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| نوع التركيب | Surface Mount (BGA) | Surface Mount (BGA) |
| حالة RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Number of LABs | — | 1,900 |
| Total Memory Bits | — | 5,760,000 |
| Maximum User I/O | — | 296 |
| Number of I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Core Voltage VCC | — | 0.9 V |
| Auxiliary Voltage VCCAUX | — | 1.1 V |
| Maximum Internal Frequency | — | 500 MHz |
| درجة حرارة التشغيل | — | -40C to +100C (industrial) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Configuration Method | — | Active serial (AS), passive serial (PS), JTAG, fast passive parallel (FPP) |
| Embedded Multipliers (18x18) | — | [DATA_NEEDED: number of 18x18 multipliers] |
| Transceiver Count | — | [DATA_NEEDED: number of embedded transceivers] |