M1AFS1500-1FGG676I vs M1AFS1500-2FG676I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ M1AFS1500-1FGG676I بواسطة Microchip Technology و M1AFS1500-2FG676I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
M1AFS1500-1FGG676I - Fusion Mixed-Signal FPGA 252 I/O | Microchip
M1AFS1500-1FGG676I ✓ نشطMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ نشطمقارنة المواصفات
| المعامل | M1AFS1500-1FGG676I | M1AFS1500-2FG676I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Fusion (Mixed-Signal FPGA) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1.5 M gates | 1.5 M |
| Logic Resources | 276480 bits | — |
| User I/O | 252 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Configuration Memory | Flash (non-volatile, instant-on) | On-chip flash (non-volatile, instant-on) |
| Speed Grade | -1 | 2 |
| العلبة | 676-pin FBGA (FGG676) | 676-ball FBGA (FG676) |
| درجة حرارة التشغيل | -40C to +85C (industrial) | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Analog Peripherals | Integrated configurable analog blocks (voltage, current, temperature monitoring) | — |
| Embedded Flash Memory | Large flash memory blocks integrated | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| On-Chip Frequency Characterization | 1282.05 MHz (datasheet family metric) | — |
| Packaging | Tray | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| مستوى MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| نطاق درجة حرارة التشغيل | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |