M1AFS1500-FG676I vs M1AFS1500-2FG676I مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ M1AFS1500-FG676I بواسطة Microchip Technology و M1AFS1500-2FG676I بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
M1AFS1500-FG676I - 1.5M Gate Fusion FPGA 676-FBGA | Microchip
M1AFS1500-FG676I ✓ نشطMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ نشطمقارنة المواصفات
| المعامل | M1AFS1500-FG676I | M1AFS1500-2FG676I |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Family | Fusion (M1AFS1500) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1.5 M | 1.5 M |
| Technology | 130 nm flash-based | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| User I/O | 252 | — |
| العلبة | 676-ball FBGA (FG676) | 676-ball FBGA (FG676) |
| نوع التركيب | Surface Mount | Surface Mount |
| Configuration Type | Flash-based, non-volatile (no external config PROM) | — |
| Analog Blocks | Configurable analog subsystem (ADC, voltage/temp monitors) | — |
| Clock Management | Integrated CCC (clock conditioning circuits) with PLL | — |
| On-chip Flash Memory | Large flash memory blocks integrated | — |
| Performance Figure | 1098.9 MHz (family-rated internal clock figure) | — |
| Temperature Grade | Industrial (-40C to +85C), suffix I | — |
| Packaging | Tray | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| مستوى MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Process Technology | — | 130 nm CMOS |
| Speed Grade | — | 2 |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| نطاق درجة حرارة التشغيل | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |