MC9S08AW48CFGE vs MC9S08AW60CFGE مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08AW48CFGE بواسطة NXP Semiconductors و MC9S08AW60CFGE بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08AW48CFGE | MC9S08AW60CFGE |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | NRND |
| Core | HCS08 (S08) | — |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory (Flash) | 48 KB (48K x 8) | — |
| RAM Size | 2 KB | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| I/O Ports | 38 (per NXP summary); 34 (per distributor listing) | — |
| جهد التغذية | 2.7 V to 5.5 V | — |
| العلبة | 44-pin LQFP (10x10 mm, 0.5 mm pitch) | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Operating Temperature Grade | Industrial | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Instruction Set | HC08 with added BGND instruction | HC08 instruction set with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BKGD) | Single-wire background debug mode (BDM) |
| ROM Type | Flash | — |
| نوع التركيب | Surface Mount | Surface Mount |
| حالة RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Maximum CPU Frequency | — | 40 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 general-purpose I/O |
| ADC Resolution | — | 10-bit, 8-channel |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| درجة حرارة التشغيل | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| حالة دورة الحياة | — | NRND (Not Recommended for New Designs) per NXP |
| Family | — | MC9S08AW (S08AW series) |