MC9S08AW48CFGE vs MC9S08AW60CFGE Perbandingan
Perbandingan bersamaan detil MC9S08AW48CFGE dari NXP Semiconductors dan MC9S08AW60CFGE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MC9S08AW48CFGE | MC9S08AW60CFGE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core | HCS08 (S08) | — |
| Core Size | 8-bit | 8-Bit |
| CPU Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Program Memory (Flash) | 48 KB (48K x 8) | — |
| RAM Size | 2 KB | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) |
| I/O Ports | 38 (per NXP summary); 34 (per distributor listing) | — |
| Tegangan Pemuat | 2.7 V to 5.5 V | — |
| Paket | 44-pin LQFP (10x10 mm, 0.5 mm pitch) | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 |
| Operating Temperature Grade | Industrial | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Instruction Set | HC08 with added BGND instruction | HC08 instruction set with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BKGD) | Single-wire background debug mode (BDM) |
| ROM Type | Flash | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Maximum CPU Frequency | — | 40 MHz |
| Flash Memory | — | 60 KB (60K x 8) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 general-purpose I/O |
| ADC Resolution | — | 10-bit, 8-channel |
| Supply Voltage Nominal | — | 3.3 V / 5 V |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |
| Status Lingkungan Hidup | — | NRND (Not Recommended for New Designs) per NXP |
| Family | — | MC9S08AW (S08AW series) |