MC9S08DV48AMLC vs MC9S08DV60AMLC مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08DV48AMLC بواسطة NXP Semiconductors و MC9S08DV60AMLC بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08DV48AMLC | MC9S08DV60AMLC |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | Obsolete | NRND |
| Core Processor | S08 (HCS08) | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Maximum CPU Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 48KB (48K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2K x 8 | 3 KB |
| EEPROM Size | - | — |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Number of I/O | 25 | [DATA_NEEDED: GPIO count] |
| Interrupt/Reset Sources | Up to 32 | Up to 32 |
| جهد التغذية | 3.3 V / 5 V | [DATA_NEEDED: supply voltage range] |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| العلبة | 32-LQFP (7 x 7 mm) | 32-LQFP (7 x 7 mm) |
| نوع التركيب | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | — |
| Temperature Grade | Automotive | — |
| Part Status | Obsolete | — |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Flash Memory | — | 60 KB (60K x 8) |
| On-Chip Debug | — | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | — | Embedded CAN |
| Target Markets | — | Automotive and industrial |
| حالة RoHS | — | [DATA_NEEDED: RoHS status] |
| حالة دورة الحياة | — | NRND (Not Recommended for New Designs) |