MC9S08QG4CDTE vs MC9S08QG4CPAE مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08QG4CDTE بواسطة NXP Semiconductors و MC9S08QG4CPAE بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08QG4CDTE | MC9S08QG4CPAE |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | نشط |
| Product Type | 8-bit S08 CISC microcontroller | — |
| CPU Clock | 20 MHz | — |
| Program Memory | 4 KB flash | — |
| Program Memory Organization | 4K x 8 bits | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Architecture | HCS08 enhanced 8-bit core | — |
| Instruction Set | HC08 instruction set with BGND instruction | — |
| I/O Port Count | 6 | — |
| العلبة | 16-TSSOP | 8-pin PDIP (CPAE) |
| نوع التركيب | Surface mount | Through-Hole |
| Debug Support | Background debugging system with single breakpoint capability | — |
| Product Family | S08QG | — |
| Core Category | 8-bit microcontroller | — |
| Application Category | Low-power embedded control | — |
| درجة حرارة التشغيل | [DATA_NEEDED: operating temperature range] | -40 C to +85 C (industrial) |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| حالة RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Core Architecture | — | HCS08 (8-bit, enhanced HC08 core) |
| Maximum CPU Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| I/O Pins | — | 6 |
| ADC | — | 10-bit, 4-channel |
| Debug Interface | — | Background Debug Controller (BDC), single breakpoint |
| Internal Clock | — | Yes (ICS with FLL, often removes need for external crystal) |
| Timers | — | TPM (Timer/PWM Module) |
| Communication | — | SCI (UART), optional I2C(2) |