MC9S08QG4CFKE vs MC9S08QG4CFQE مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08QG4CFKE بواسطة NXP Semiconductors و MC9S08QG4CFQE بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control
MC9S08QG4CFQE ✗ انتهى عمره الإنتاجيمقارنة المواصفات
| المعامل | MC9S08QG4CFKE | MC9S08QG4CFQE |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | نشط | نهاية العمر الإنتاجي |
| Core Architecture | HCS08 (S08) | — |
| Core Size | 8-bit | — |
| Maximum CPU Clock | 20 MHz | — |
| Program Memory | 4 KB Flash (4K x 8) | — |
| RAM | [DATA_NEEDED: RAM size in bytes] | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| درجة حرارة التشغيل | -40 C to +85 C | — |
| I/O Ports | 6 (per distributor listing) | 6 ports |
| ADC | 10-bit (per LCSC listing) | — |
| العلبة | 24-QFN-EP (4x4 mm) | 8-DFN-EP (4 mm x 4 mm) |
| نوع التركيب | Surface Mount | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint | — |
| Instruction Set | HC08 with BGND instruction | — |
| مستوى MSL | [DATA_NEEDED: MSL level] | — |
| حالة RoHS | Compliant | RoHS compliant |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Clock Speed | — | 20 MHz |
| Architecture | — | HCS08, HC08 instruction set with added BGND instruction |
| Flash Memory | — | 4 KB (4K x 8) |
| Package Type | — | DFN with exposed pad |
| Core | — | 8-bit HCS08 central processing unit |
| Debug Support | — | Background debugging system |
| Breakpoint Support | — | Single breakpoint during in-circuit debugging plus two on-chip breakpoints |
| Shipping Package | — | Tray |
| Temperature Grade | — | [DATA_NEEDED: operating temperature range] |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Maximum GPIO | — | [DATA_NEEDED: maximum GPIO count] |