MC9S08QG4CFKE vs MC9S08QG4CFQE तुलना
विस्तृत दोनों ओर की तुलना MC9S08QG4CFKE द्वारा NXP Semiconductors और MC9S08QG4CFQE द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control
MC9S08QG4CFQE ✗ जीवन की समाप्तिविशेषता तुलना
| पैरामीटर | MC9S08QG4CFKE | MC9S08QG4CFQE |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | उत्पादन बंद |
| Core Architecture | HCS08 (S08) | — |
| Core Size | 8-bit | — |
| Maximum CPU Clock | 20 MHz | — |
| Program Memory | 4 KB Flash (4K x 8) | — |
| RAM | [DATA_NEEDED: RAM size in bytes] | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| ऑपरेटिंग तापमान | -40 C to +85 C | — |
| I/O Ports | 6 (per distributor listing) | 6 ports |
| ADC | 10-bit (per LCSC listing) | — |
| पैकेज | 24-QFN-EP (4x4 mm) | 8-DFN-EP (4 mm x 4 mm) |
| माउंटिंग प्रकार | Surface Mount | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint | — |
| Instruction Set | HC08 with BGND instruction | — |
| MSL स्तर | [DATA_NEEDED: MSL level] | — |
| RoHS स्थिति | Compliant | RoHS compliant |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Clock Speed | — | 20 MHz |
| Architecture | — | HCS08, HC08 instruction set with added BGND instruction |
| Flash Memory | — | 4 KB (4K x 8) |
| Package Type | — | DFN with exposed pad |
| Core | — | 8-bit HCS08 central processing unit |
| Debug Support | — | Background debugging system |
| Breakpoint Support | — | Single breakpoint during in-circuit debugging plus two on-chip breakpoints |
| Shipping Package | — | Tray |
| Temperature Grade | — | [DATA_NEEDED: operating temperature range] |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Maximum GPIO | — | [DATA_NEEDED: maximum GPIO count] |