MC9S08SH4CTJ vs MC9S08SH4MFK مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MC9S08SH4CTJ بواسطة NXP Semiconductors و MC9S08SH4MFK بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | MC9S08SH4CTJ | MC9S08SH4MFK |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Microcontrollers | Microcontrollers |
| حالة دورة الحياة | NRND | نشط |
| Core Architecture | HCS08 (enhanced 8-bit) | — |
| CPU Bit Width | 8-bit | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor | 12-channel, 10-bit, 2.5 us conversion |
| Timers | MTIM, RTI, TPM (PWM) | — |
| Communication Interfaces | SCI/UART, SPI, I2C | — |
| Analog Comparator | Yes (integrated) | — |
| العلبة | 20-pin TSSOP | — |
| نوع التركيب | Surface Mount | Surface Mount |
| درجة حرارة التشغيل | -40 C to +85 C (industrial, TJ suffix implied) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Low-Power Modes | STOP, WAIT with fast wake-up | — |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | HC08 with BGND instruction |
| Interrupt Sources | Up to 32 | — |
| حالة RoHS | Compliant | — |
| Core | — | HCS08 (8-bit) |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| RAM Size | — | 256 B |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| العلبة / الحالة | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |