MC9S08SH4CTJ vs MC9S08SH4MFK Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08SH4CTJ disebabkan oleh NXP Semiconductors dan MC9S08SH4MFK disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08SH4CTJ | MC9S08SH4MFK |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | Aktif |
| Core Architecture | HCS08 (enhanced 8-bit) | — |
| CPU Bit Width | 8-bit | — |
| Maximum Bus Frequency | 40 MHz | — |
| Program Memory (Flash) | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| ADC | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor | 12-channel, 10-bit, 2.5 us conversion |
| Timers | MTIM, RTI, TPM (PWM) | — |
| Communication Interfaces | SCI/UART, SPI, I2C | — |
| Analog Comparator | Yes (integrated) | — |
| Kemasan | 20-pin TSSOP | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | -40 C to +85 C (industrial, TJ suffix implied) | -40 C to +85 C (industrial, [DATA_NEEDED: confirm exact grade]) |
| Low-Power Modes | STOP, WAIT with fast wake-up | — |
| Debug Interface | Single-wire BDM (background debug mode) | — |
| Instruction Set | HC08 with BGND extension | HC08 with BGND instruction |
| Interrupt Sources | Up to 32 | — |
| Status RoHS | Compliant | — |
| Core | — | HCS08 (8-bit) |
| Program Memory Size | — | 4 KB (4K x 8) Flash |
| RAM Size | — | 256 B |
| Maximum CPU Clock | — | 40 MHz |
| Number of I/O Pins | — | 17 |
| Kemasan / Case | — | 24-VFQFN Exposed Pad (4x4 mm) |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| Oscillator Type | — | Internal |
| Interrupt/Reset Sources | — | Up to 32 |
| Packaging | — | Tray |
| Compliance | — | RoHS compliant ([DATA_NEEDED: confirm exact status]) |