MPXV7025GP vs MPXV7007GC6U مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ MPXV7025GP بواسطة NXP Semiconductors و MPXV7007GC6U بواسطة NXP Semiconductors. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
NXP Semiconductors
MPXV7025GP - ±25kPa Compound Pressure Sensor, 8-SMD | NXP Semiconductors
MPXV7025GP ✓ نشطمقارنة المواصفات
| المعامل | MPXV7025GP | MPXV7007GC6U |
|---|---|---|
| العلامة التجارية | NXP Semiconductors | NXP Semiconductors |
| الفئة | Pressure Sensors | Pressure Sensors |
| حالة دورة الحياة | نشط | نشط |
| Pressure Type | Compound (positive and vacuum) | — |
| Operating Pressure Range | ±3.63 PSI (±25 kPa) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| نوع الخرج | Analog voltage | Analog, ratiometric |
| نطاق جهد الخرج | 0.2 V to 4.7 V | 0.5 V to 4.5 V |
| Output Span | 4.5 V (typical) | 4.0 V (typical, VFS - Voffset) |
| Pressure Port | Male - 0.13" (3.18 mm) Tube, Side | — |
| جهد التغذية | 5 V typical (ratiometric output) | 5.0 V (typical) |
| تيار التغذية | [DATA_NEEDED: supply current] | 7 mA (typical) |
| Accuracy | [DATA_NEEDED: accuracy %FS] | ±1.5 %VFSS (max over compensated range) |
| درجة حرارة التشغيل | -40C to +125C | -40 °C to +125 °C |
| العلبة / الحالة | 8-SMD, Gull Wing, Side Port | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Technology | Piezoresistive MEMS with on-chip ASIC | MEMS piezoresistive, Wheatstone-bridge on-chip |
| Port Style | Single side port with barbed stem | — |
| حالة RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Product Type | — | Integrated silicon pressure sensor |
| Manufacturer | — | NXP Semiconductors |
| Pressure Range | — | -7 kPa to +7 kPa (compound, ±1.02 PSI) |
| Operating Pressure - Max | — | +7 kPa |
| Operating Pressure - Min | — | -7 kPa |
| Compensated Temperature | — | 0 °C to +85 °C |
| Port Type | — | Axial, top port, accepts 3.17 mm (1/8 in) tube |
| العلبة | — | 8-SMD, Gull Wing, Top Port (SOP-8) |
| Package Dimensions | — | 11.4 mm x 8.1 mm x 6.4 mm |
| Signal Conditioning | — | On-chip amplifier, temperature compensation, calibration |
| ESD Protection (Port) | — | 2 kV HBM |
| ESD Protection (Signal Pins) | — | 200 V HBM |
| Lead-Free | — | Yes |