MPXV7025GP vs MPXV7007GC6U Vergleich

Detaillierter Direktvergleich von MPXV7025GP von NXP Semiconductors und MPXV7007GC6U von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPXV7007GC6U MPXV7007GC6U - ±7kPa Compound Pressure Sensor 5V SOP-8 | NXP

MPXV7007GC6U - ±7kPa Compound Pressure Sensor 5V SOP-8 | NXP

MPXV7007GC6U ✓ Aktiv

Spezifikationsvergleich

Parameter MPXV7025GP MPXV7007GC6U
Marke NXP Semiconductors NXP Semiconductors
Kategorie Pressure Sensors Pressure Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $7,50 $14,10
Pressure Type Compound (positive and vacuum) —
Operating Pressure Range ±3.63 PSI (±25 kPa) —
Maximum Overload Pressure [DATA_NEEDED: maximum overload pressure] —
Ausgangstyp Analog voltage Analog, ratiometric
Ausgangsspannungsbereich 0.2 V to 4.7 V 0.5 V to 4.5 V
Output Span 4.5 V (typical) 4.0 V (typical, VFS - Voffset)
Pressure Port Male - 0.13" (3.18 mm) Tube, Side —
Versorgungsspannung 5 V typical (ratiometric output) 5.0 V (typical)
Versorgungsstrom [DATA_NEEDED: supply current] 7 mA (typical)
Accuracy [DATA_NEEDED: accuracy %FS] ±1.5 %VFSS (max over compensated range)
Betriebstemperatur -40C to +125C -40 °C to +125 °C
Gehäuse / Bauform 8-SMD, Gull Wing, Side Port —
Montageart Surface Mount Surface Mount
Technology Piezoresistive MEMS with on-chip ASIC MEMS piezoresistive, Wheatstone-bridge on-chip
Port Style Single side port with barbed stem —
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Product Type — Integrated silicon pressure sensor
Manufacturer — NXP Semiconductors
Pressure Range — -7 kPa to +7 kPa (compound, ±1.02 PSI)
Operating Pressure - Max — +7 kPa
Operating Pressure - Min — -7 kPa
Compensated Temperature — 0 °C to +85 °C
Port Type — Axial, top port, accepts 3.17 mm (1/8 in) tube
Gehäuse — 8-SMD, Gull Wing, Top Port (SOP-8)
Package Dimensions — 11.4 mm x 8.1 mm x 6.4 mm
Signal Conditioning — On-chip amplifier, temperature compensation, calibration
ESD Protection (Port) — 2 kV HBM
ESD Protection (Signal Pins) — 200 V HBM
Lead-Free — Yes

Datenblätter & Ressourcen

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