RTAX2000D-1CQ352V vs RTAX2000D-1CQ352B مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ RTAX2000D-1CQ352V بواسطة Microchip Technology و RTAX2000D-1CQ352B بواسطة Microchip Technology. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Microchip Technology
RTAX2000D-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000D-1CQ352V ✓ نشطMicrochip Technology
RTAX2000D-1CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000D-1CQ352B ✓ نشطمقارنة المواصفات
| المعامل | RTAX2000D-1CQ352V | RTAX2000D-1CQ352B |
|---|---|---|
| العلامة التجارية | Microchip Technology | Microchip Technology |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | نشط | نشط |
| Equivalent Gates | 2,000,000 | — |
| Logic Cells | 29,568 | — |
| CLBs | 19,712 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) | 1.5 V nominal (1.425 V to 1.575 V) |
| DSP Mathblocks | Up to 120 | Up to 120 (18-bit x 18-bit MAC) |
| DSP MAC Performance | 125 MHz, 18-bit x 18-bit multiply-accumulate | — |
| Embedded Memory | Up to 540 kbits with optional EDAC protection | Up to 540 kbits SRAM with optional EDAC |
| Technology | Digital CMOS, antifuse (nonvolatile) | Antifuse (nonvolatile), Digital CMOS |
| Total Ionizing Dose (Functional) | 300 krad (Si) | — |
| Total Ionizing Dose | 200 krad (Si) | 300 krad (Si) functional / 200 krad (Si) with operation |
| Configuration | Live at power-up, single-chip, no external configuration device | Live at power-up, no external configuration device (antifuse) |
| Speed Grade | -1 | -1 |
| العلبة | CQFP-352 (CQ352), ceramic | 352-pin Ceramic Column Grid Array (CQ352) |
| نوع التركيب | Surface Mount | Surface Mount (ceramic column grid array) |
| Screening | RTAX-D (Condition A, tighter ICCA limits at 125C final electrical test) | — |
| درجة حرارة التشغيل | [DATA_NEEDED: Operating Temperature] | — |
| حالة RoHS | [DATA_NEEDED: RoHS Status] | — |
| Family | — | RTAX-S/SL and RTAX-DSP (RTAX2000D) |
| Equivalent System Gates | — | 2,000,000 |
| CLBs (Logic Cells) | — | 19,712 CLBs / 29,568 logic cells (per family organization) |
| DSP Performance | — | 125 MHz 18-bit x 18-bit multiply-accumulate |
| Temperature Range | — | Commercial (C) |
| Routing Features | — | Segmentable clocks, chip-wide highway routing, carry logic |
| Embedded SRAM Features | — | Built-in FIFO control logic |
| Application Domain | — | Space-flight, radiation-tolerant |