RTAX2000D-1CQ352V vs RTAX2000D-1CQ352B तुलना
विस्तृत दोनों ओर की तुलना RTAX2000D-1CQ352V द्वारा Microchip Technology और RTAX2000D-1CQ352B द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
RTAX2000D-1CQ352V - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000D-1CQ352V ✓ सक्रियMicrochip Technology
RTAX2000D-1CQ352B - 2M-Gate Rad-Tolerant FPGA | Microchip
RTAX2000D-1CQ352B ✓ सक्रियविशेषता तुलना
| पैरामीटर | RTAX2000D-1CQ352V | RTAX2000D-1CQ352B |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Equivalent Gates | 2,000,000 | — |
| Logic Cells | 29,568 | — |
| CLBs | 19,712 | — |
| Core Supply Voltage | 1.425 V to 1.575 V (nominal 1.5 V) | 1.5 V nominal (1.425 V to 1.575 V) |
| DSP Mathblocks | Up to 120 | Up to 120 (18-bit x 18-bit MAC) |
| DSP MAC Performance | 125 MHz, 18-bit x 18-bit multiply-accumulate | — |
| Embedded Memory | Up to 540 kbits with optional EDAC protection | Up to 540 kbits SRAM with optional EDAC |
| Technology | Digital CMOS, antifuse (nonvolatile) | Antifuse (nonvolatile), Digital CMOS |
| Total Ionizing Dose (Functional) | 300 krad (Si) | — |
| Total Ionizing Dose | 200 krad (Si) | 300 krad (Si) functional / 200 krad (Si) with operation |
| Configuration | Live at power-up, single-chip, no external configuration device | Live at power-up, no external configuration device (antifuse) |
| Speed Grade | -1 | -1 |
| पैकेज | CQFP-352 (CQ352), ceramic | 352-pin Ceramic Column Grid Array (CQ352) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (ceramic column grid array) |
| Screening | RTAX-D (Condition A, tighter ICCA limits at 125C final electrical test) | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: Operating Temperature] | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS Status] | — |
| Family | — | RTAX-S/SL and RTAX-DSP (RTAX2000D) |
| Equivalent System Gates | — | 2,000,000 |
| CLBs (Logic Cells) | — | 19,712 CLBs / 29,568 logic cells (per family organization) |
| DSP Performance | — | 125 MHz 18-bit x 18-bit multiply-accumulate |
| Temperature Range | — | Commercial (C) |
| Routing Features | — | Segmentable clocks, chip-wide highway routing, carry logic |
| Embedded SRAM Features | — | Built-in FIFO control logic |
| Application Domain | — | Space-flight, radiation-tolerant |