ZM5101A-CME3R vs ZM5202 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ ZM5101A-CME3R بواسطة Silicon Labs و ZM5202 بواسطة Silicon Labs. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
Silicon Labs
ZM5101A-CME3R - Z-Wave 500 SiP Module, Sub-GHz, 8051 MCU | Silicon Labs
ZM5101A-CME3R ✓ نشطمقارنة المواصفات
| المعامل | ZM5101A-CME3R | ZM5202 |
|---|---|---|
| العلامة التجارية | Silicon Labs | Silicon Labs |
| الفئة | RF Modules | RF Modules |
| حالة دورة الحياة | نشط | NRND |
| الوظيفة | Z-Wave 500 Series Wireless System-in-Package (TxRx + MCU) | — |
| RF Protocol | Z-Wave (Z-Wave Plus compatible) | — |
| Operating Frequency | 865.2 MHz to 926.3 MHz (868 MHz / 908 MHz / 921 MHz regional) | — |
| Output Power | 6 dBm (max) | approximately 4 dBm (typical) |
| Receive Sensitivity | -94.3 dBm at 100 kbps (some sources list -104 dBm at lower rate) | — |
| معدل البيانات | 100 kbps (max) | — |
| جهد التغذية التشغيلي | 2.3 V to 3.6 V (typical 3.3 V) | — |
| Receive Current | 32 mA (typical) | — |
| MCU Core | Optimized 8051 | — |
| Flash Memory | 128 kB | — |
| SRAM | 16 kB | — |
| UART | 2 x UART up to 230.4 kbps | — |
| SPI | 2 x SPI up to 8 MHz | — |
| ADC | 4-channel 12/8-bit rail-to-rail, VDD/internal/external reference | — |
| Security | Hardware AES-128 engine | — |
| Dimmer Control | 1000-step dimmer | — |
| العلبة | 56-TFLGA (Module), 8 mm x 8 mm x 1.2 mm | — |
| نوع التركيب | Surface Mount | Surface Mount |
| Packaging | Reel (R suffix) | — |
| RoHS | Compliant | — |
| Module Type | — | Z-Wave 500 Series RF Transceiver Module (PCB SiP-like module) |
| Inside the Module | — | SD3502 SoC with 8051 MCU core + Z-Wave RF transceiver + crystal + SAW filter + passives |
| Frequency Band | — | Sub-1 GHz ISM (908 / 908.42 / 916 MHz regional Z-Wave channels) |
| Receiver Sensitivity | — | -93.0 dBm (typical) |
| Modulation | — | Z-Wave FSK (per Z-Wave PHY specification) |
| Host Interface | — | GPIO / serial host interface to external MCU |
| GPIO Count | — | up to 32 GPIOs (sufficient for single-MCU designs) |
| Module Footprint | — | approximately 8 mm x 8 mm (PCB module) |
| Module Package Dimensions | — | 12.5 mm x 13.6 mm x 1.9 mm (per datasheet outline) |
| جهد التغذية | — | [DATA_NEEDED: supply voltage range from datasheet] |
| درجة حرارة التشغيل | — | [DATA_NEEDED: operating temperature range from datasheet] |
| Backwards Compatibility | — | Pin/pad compatible with ZM3102 and ZM4102 modules |
| Regulatory | — | Module-level regulatory qualification to support end-product certifications |