Epomaker Galaxy75 wireless keyboard adds 75% layout, aluminium case, VIA support
Epomaker confirmed a 75% Galaxy keyboard with VIA remapping, aluminium chassis, gasket mount, and Creamy Jade linear switches; pricing is still unconfirmed.
ما الذي تغيّر اليوم، ولماذا يهم قائمة المواد (BOM) الخاصة بك، وما الذي يجب مراقبته. كل ادعاء واقعي قابل للتتبع إلى مصدره؛ وتحليلنا الخاص مُعلَّم ومفصول.
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Epomaker confirmed a 75% Galaxy keyboard with VIA remapping, aluminium chassis, gasket mount, and Creamy Jade linear switches; pricing is still unconfirmed.
NVIDIA pairs a 20-core Grace CPU with a 6,144-CUDA Blackwell iGPU under the RTX Spark name, backed by Microsoft and game studios for Arm64 translation and kernel-mode anti-cheat parity.
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Embedded.com reports latency in edge AI hinges on the full sensor-to-actuator chain, not inference alone. Designers must co-design memory, DMA, NPUs, and RTOS to hit worst-case deadlines.
SEMI projects 300 mm front-end fab equipment spend rising to $149B in 2026 (+31% YoY) and $227B in 2029, with 20 new fabs/lines starting construction in 2026.
Skyworks completes its Qorvo combination, targeting $500M+ in annual cost synergies and broader RF GaN and power portfolios. Engineers and buyers should watch for SKU consolidation and lead-time shifts.
Cirrus Logic acquires fabless Pavia firm INVENTVM, inheriting PiezoDrive amplifier IP, DSP and power-conversion expertise. No price, headcount or product-merge roadmap disclosed yet.
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A US vendor books optical capacity into 2029, DDR5 and DDR4 spot prices move in opposite directions, and CPU hikes of up to 20% hit server stacks.
Littelfuse issues PCN ZAC26-0074 taking final eZ80 orders through 2026-12-21, with deliveries winding down through 2027, closing the Z80 family chapter.
Navitas closes its Claros deal, folding integrated voltage regulators into a GaN and SiC portfolio targeting 800 V AI data centre power from grid to processor.
Applied Materials and Intel are co-locating R&D at the new Silicon Valley EPIC Center and Intel's Oregon campus to speed next-gen transistors, interconnects and Foveros 3D packaging for AI compute.
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