10M08SCU324C8G - MAX 10 FPGA 8K LE 324-LFBGA | Intel
MPN: 10M08SCU324C8G ✓ نشط10M08SCU324C8G نظرة عامة
What is a low-density FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable fabric and surrounded by programmable I/O cells. Unlike a fixed-function ASIC, an FPGA's logic function is defined after manufacturing by loading a user bitstream into on-chip SRAM configuration memory. The MAX 10 family belongs to Intel's non-volatile, small-form-factor FPGA tier - positioned below Cyclone in density but above CPLDs in capability, targeting glue-logic replacement, I/O expansion, motor control, and bridge/interface consolidation on a single chip.
Key features of the 10M08SCU324C8G include: 8,000 logic elements (LEs) for parallel logic implementation; 378 Kbits (387,072 bits) of embedded SRAM for data buffering and FIFO applications; a 1.2V core operating voltage; integrated ADC block (MAX 10 family feature); on-chip flash configuration memory that makes the device instant-on without an external boot PROM; 246 maximum user I/O supporting LVDS, LVCMOS, SSTL, and other single-ended/differential standards; and a commercial operating temperature range of 0C to +85C.
Architecturally, the 10M08 device is built on a TSMC 55nm embedded-flash process. The on-chip flash eliminates the external configuration memory typically required by SRAM-based FPGAs, enabling single-chip designs and sub-100ms power-on-to-user-I/O-active times. The U324 package provides 246 usable I/O with a 1.0mm ball pitch, balancing I/O count against PCB routing complexity for mid-complexity designs.
Typical applications include industrial machine vision front-ends, motor control and drive interfaces, low-cost video bridging (e.g., parallel CMOS to MIPI), factory automation I/O concentrators, consumer appliance human-machine interfaces (HMI), and as a logic/interface consolidator replacing multiple CPLDs and discrete glue logic.
When designing with the 10M08SCU324C8G, allocate I/O banks according to the voltage standards used (each bank shares a VCCIO rail), provide at least four PCB layers for signal integrity with the BGA fan-out, and leverage the Quartus Prime Lite toolchain (free for MAX 10) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, drop-in MAX 10 same-package alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet.
بدائل مباشرة لـ 10M08SCU324C8G — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع 10M08SCU324C8G (نفس عامل الشكل والبصمة) — يختلف في Package, Logic Elements (LE), Process Technology, Configuration Memory, PLLs.
10M08SAU324I7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M08SAU324C8G
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
10M08DAU324I7G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M08DAU324C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M04SCU324C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M02SCU324C8G
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←10M08SCU324C8G الحدود القصوى والخصائص الكهربائية
| Family | MAX 10 |
| Logic Elements (LE) | 8,000 |
| Embedded Memory (bits) | 387,072 |
| Embedded Memory (Kbits) | 378 Kbits |
| Maximum User I/O | 246 |
| العلبة | 324-LFBGA (U324) |
| Package Pitch | 1.0 mm |
| درجة حرارة التشغيل | 0C to +85C (commercial) |
| Speed Grade | 8 |
| Core Voltage | 1.2 V |
| Configuration Memory | On-chip flash (non-volatile) |
| Process Technology | 55 nm embedded flash |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
| مستوى MSL | 3 |
| Supported I/O Standards | LVCMOS, LVTTL, LVDS, SSTL, HSTL |
| Development Tool | Quartus Prime Lite |
دليل تكوين أطراف 10M08SCU324C8G 1.0 mm
تكوين الأطراف لـ 10M08SCU324C8G (حزمة 1.0 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ 10M08SCU324C8G.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
10M08SCU324C8G مناسب لـ 6 التطبيقs: Industrial Machine Vision Front-End, Motor Control and Drive Interface, Low-Cost Video Bridge (Parallel CMOS to MIPI/USB3), Factory Automation I/O Concentrator, Consumer Appliance HMI Controller, Glue-Logic and Interface Consolidator.
Industrial Machine Vision Front-End
The 10M08SCU324C8G fits industrial machine vision pre-processing interfaces because its 8,000 logic elements and 246 user I/O can absorb parallel CMOS sensor aggregation, line-buffer memory, and a soft I2C/SPI control plane in a single chip. The 378 Kbits of embedded SRAM is sized for two-line buffers of a typical 2K-pixel sensor, removing the need for an external SRAM. Integrated hard ADC blocks (MAX 10 family feature) digitize ambient light sensors for adaptive exposure control. Designers can prototype with the Quartus Prime Lite toolchain and migrate to the industrial-temperature 10M08SAU324I7G for the same PCB at production volume.
موصى به
Motor Control and Drive Interface
In BLDC and stepper motor drives, the 10M08SCU324C8G delivers deterministic PWM generation, Hall-sensor decoding, and field-oriented control (FOC) state machines at switching frequencies up to 100 kHz. With 8K logic elements, it can host the soft FOC algorithm plus encoder/Resolver interfaces without external logic, while 246 user I/O accommodate multi-axis current-sense ADCs and fault inputs. The integrated ADC block samples shunt currents at the required bandwidth, eliminating a dedicated ADC chip. The C8G commercial speed grade is adequate for sub-100kHz FOC loops; designs needing 200kHz+ loops should select speed grade 7.
موصى به
Low-Cost Video Bridge (Parallel CMOS to MIPI/USB3)
The 10M08SCU324C8G serves as a parallel-CMOS-to-MIPI-CSI2 or to USB3.0 video bridge for embedded cameras and low-cost industrial vision, providing the parallel video input port, color-space conversion, and the MIPI DPHY low-level protocol layer in a single device. The 246 user I/O easily absorb 24-bit parallel video plus control signals, while 378 Kbits of M9K memory provide line buffering. Quartus Prime Lite's free license and the FPGA's on-chip flash enable low-BOM designs without external boot memory, ideal for cost-sensitive consumer and prosumer vision products.
موصى به
Factory Automation I/O Concentrator
As an I/O concentrator on a factory floor, the 10M08SCU324C8G aggregates dozens of digital inputs (limit switches, proximity sensors, buttons), drives relay and SSR outputs, and presents a single EtherCAT or PROFINET slave interface to the PLC through a companion ASIC. Its 246 user I/O easily handle 16-32 channels of optically-isolated 24V digital I/O plus diagnostic LEDs. The integrated flash eliminates configuration time at power-cycle, critical for industrial control uptime. Designers commonly pair this part with the Anybus CompactCom or a dedicated ET1100 EtherCAT slave controller for deterministic fieldbus communication.
موصى به
Consumer Appliance HMI Controller
The 10M08SCU324C8G is well-suited to washing machine, dishwasher, and induction-cooktop human-machine interface controllers because it can drive TFT-LCD panels, scan capacitive touch keys, manage multi-LED animations, and host a soft Nios V/lite RISC-V core for appliance control - all in a single chip. With 246 user I/O and 378 Kbits of embedded RAM, it removes the discrete LCD driver, CPLD, and microcontroller that traditional designs stack together. The instant-on feature of on-chip flash is critical for HMI response within 200 ms of power-button press.
موصى به
Glue-Logic and Interface Consolidator
The 10M08SCU324C8G replaces stacks of 74-series logic, bus switches, and small CPLDs on legacy board designs by absorbing all glue logic and protocol bridging into one programmable device. Its 8K logic elements handle multiple SPI/I2C/UART bridges, custom timing generators, and watchdog logic simultaneously, while 246 user I/O replace 4-6 discrete logic chips at a lower BOM cost. The on-chip flash reduces PCB area by eliminating the boot PROM that an SRAM-based FPGA would otherwise require, and Quartus Prime Lite provides free synthesis, making this part especially attractive for low-volume industrial OEM designs.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ 10M08SCU324C8G — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | 10M08SAU324I7G | 10M08SAU324C8G | 10M08DAU324I7G | 10M08DAU324C8G | 10M04SCU324C8G |
|---|---|---|---|---|---|---|
| Package | 324-LFBGA (U324) | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same | 324-LFBGA (U324) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8,000 | 8,000 | 8,000 | 8,000 | 8,000 | 4,000 |
| Embedded Memory (Kbits) | 378 | 378 | 378 | 378 | 378 | 189 |
| Maximum User I/O | 246 | 246 | 246 | 246 | 246 | 246 |
| Operating Temperature | 0C to +85C | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Speed Grade | 8 | 7 | 7 | 7 | 8 | 8 |
| Configuration Image Type | Single image | Single image | Single image | Dual image (remote update) | Dual image (remote update) | Single image |
| Approx. Unit Price (USD, qty 1) | 27.50 | 32.00 | 28.50 | 34.00 | 29.00 | 20.00 |
أبرز الفروقات
- On-chip non-volatile flash configuration (مقابل10M08DCF256C8G (same family, different package))
- Highest density in the U324 commercial-temperature tier (مقابل10M04SCU324C8G (4K LE))
- Integrated hard ADC block (مقابل10M08DAU324C8G (dual-image variant))
ملاحظات التصميم
The U324 LFBGA package has a 1.0mm ball pitch requiring at least 4 PCB layers with microvia fan-out. Per Intel MAX 10 hardware design guidelines, allocate dedicated inner layers for GND and one for each VCCIO bank; route length-matched pairs for LVDS signals using the package's differential pin pairing documented in the device pin-out file. Estimate: total via-in-pad cost is offset by eliminating the external boot PROM that SRAM FPGAs require, so the MAX 10 PCB is typically 4-layer vs 6-layer for an equivalent Cyclone V design.
The 10M08SCU324C8G requires VCCINT (1.2V core) and per-bank VCCIO supplies (1.2V-3.3V depending on I/O standard). Estimated: at typical 25% toggle rate and all 246 I/O active, the core draws approximately 200-300 mA from VCCINT. Use a 4-layer PCB with a solid GND plane and place 100 nF decoupling capacitors within 2 mm of every VCC pin pair. VCCA (analog 2.5V for ADC) must be filtered with a ferrite bead from VCCINT to prevent digital switching noise coupling into the ADC.
Do not mistake the 10M08S (single-image) for the 10M08D (dual-image) variant if remote firmware update is required - the D variant has two flash regions supporting fail-safe over-the-air updates. Do not select speed grade 7 (I7G/A7G) when your design has critical timing at Fmax for the C8G variant; the speed grade difference shifts Fmax by approximately 15%. Always re-run Quartus Prime timing analysis after any package change to confirm hold-time closure on the new BGA ball assignments.
Place the 25 MHz or 50 MHz external crystal/oscillator within 5 mm of the CLK[0..3] pins and surround the clock trace with GND vias to minimize EMI. Route JTAG signals (TCK, TMS, TDI, TDO) with 4.7 kohm pull-ups on TCK/TMS/TDI and keep total trace length under 100 mm to avoid programming failures. The configuration DONE and nCONFIG pins require 10 kohm pull-ups to VCCIO of the bank they reside in.
معلومات الامتثال
RoHS compliant per Intel MAX 10 product family declaration. Not AEC-Q100 qualified; the -I7G industrial temperature variants are commonly used in automotive interior and industrial applications but are not formally automotive-qualified.
