10M02SCU324C8G - MAX 10 FPGA, 2K LE, 324-LFBGA | Intel
MPN: 10M02SCU324C8G β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.02 | $9.02 |
| 10 | $8.4 | $84.00 |
| 100 | $7.6 | $760.00 |
| 500 | $6.9 | $3,450.00 |
| 1,000 | $6.2 | $6,200.00 |
Drop-in alternatives for 10M02SCU324C8G β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
10M02SCU324C8GES
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02SCU324I7G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCU324A7G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02DCU324C8G
β Drop-Inπ Reference alternative (not in catalog)
10M02SCU324I6G
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
10M02SCU324C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 2,000 |
| Embedded Memory (bits) | 110,592 |
| User Flash Memory (bits) | 246,000 |
| Maximum User I/Os | 125 |
| PLLs | 2 |
| On-chip ADC | Yes (12-bit, integrated) |
| Temperature Sensor | Yes (integrated) |
| Configuration Memory | Internal flash (instant-on) |
| Operating Supply Voltage | 2.85 V to 3.465 V |
| Operating Temperature | 0 C to +85 C (commercial) |
| Package | 324-ball UBGA (U324) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Process Technology | TSMC 55 nm embedded flash |
10M02SCU324C8G 324-ball ubga (u324) Pin Configuration Guide
Complete pinout information for 10M02SCU324C8G (324-ball ubga (u324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M02SCU324C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M02SCU324C8G is suitable for 6 applications: Industrial I/O Expansion and Protocol Bridging, Motor Control and Stepper Drive Front-End, Low-Cost Video Format Conversion, IoT Edge Sensor Aggregation, Instant-On Replacement for Discrete Glue Logic, Consumer and Prototyping Development Platforms.
Industrial I/O Expansion and Protocol Bridging
The 10M02SCU324C8G is ideally suited for industrial I/O expansion modules where 125 user I/Os in a single BGA package replace dozens of discrete 74-series glue-logic ICs. Its integrated 2,000 logic elements handle UART-to-SPI, SPI-to-I2C, or parallel-to-LVDS bridges common in PLC backplanes. With on-chip flash configuration and instant-on in under 10 ms, the device boots without an external PROM, reducing BOM and board area. The 2.85 V to 3.465 V single-supply operation and integrated temperature sensor simplify thermal monitoring on the factory floor.
Recommended
Motor Control and Stepper Drive Front-End
In stepper and BLDC motor control, the 10M02SCU324C8G generates precise PWM waveforms, quadrature decoding, and closed-loop commutation logic in a single chip. Its two internal PLLs produce jitter-free clock trees for high-resolution PWM at 16-bit or greater, while the 12-bit integrated ADC samples current and back-EMF feedback without an external ADC. The 324-ball UBGA package keeps the device on a compact control board, and the commercial 0 C to +85 C range covers most indoor industrial drive enclosures.
Recommended
Low-Cost Video Format Conversion
The 10M02SCU324C8G performs simple video timing conversion, deinterlacing, or upscaling in low-cost HDMI/VGA adapter dongles where a full video processor is overkill. Its 2,000 logic elements and embedded SRAM buffer scan-line data at standard-definition resolutions, while its support for LVDS and LVCMOS I/O standards directly interfaces to HDMI PHY chips and parallel RGB LCDs. The instant-on behavior means the dongle is ready as soon as power is applied, with no boot screen flash.
Recommended
IoT Edge Sensor Aggregation
For IoT edge gateways, the 10M02SCU324C8G aggregates data from SPI, I2C, and UART sensors and performs local filtering before forwarding via a high-speed UART or SPI link to a host MCU. The integrated 12-bit ADC reads analog sensor channels directly, and the on-chip temperature sensor enables board-level thermal monitoring without extra components. Instant-on non-volatile configuration is critical for battery-powered or wake-from-sleep applications where a 100 ms SRAM FPGA boot delay is unacceptable.
Recommended
Instant-On Replacement for Discrete Glue Logic
Designers frequently replace dozens of 74HC/74AHC logic ICs with a single 10M02SCU324C8G to reduce board area, BOM cost, and BOM risk in long-lifecycle products. The 2,000 logic elements can absorb complex address decoding, bus arbitration, and reset sequencing that would otherwise require 15 to 30 discrete gates. Because the configuration is stored in internal flash, the device behaves like standard logic with no boot delay, making it transparent to downstream processors and ASICs.
Recommended
Consumer and Prototyping Development Platforms
The 10M02SCU324C8G is widely deployed on Intel/Altera MAX 10 FPGA development boards and educational kits because the non-volatile configuration lets students and hobbyists iterate without re-flashing an external PROM. Its commercial 0 C to +85 C temperature range is well suited to indoor use, and the 324-ball UBGA package exposes enough I/Os to drive character LCDs, keypads, RGB LEDs, and breadboard-friendly breakout headers. Quartus Prime Lite Edition is a free toolchain supporting this device, lowering the entry barrier for first-time FPGA users.
Recommended
Recommended Products Summary
Engineering reference data for 10M02SCU324C8G β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M02SCU324C8GES | 10M02SCU324I7G | 10M02SCU324A7G | 10M02DCU324C8G | 10M02SCU324I6G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball UBGA (U324) | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same | 324-ball UBGA (U324) - same |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| Embedded Memory (bits) | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| Maximum User I/Os | 125 | 125 | 125 | 125 | 125 | 125 |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) | 0 C to +85 C (commercial) | 0 C to +85 C (commercial) | -40 C to +100 C (industrial) |
| Supply Voltage | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V | 2.85 V to 3.465 V |
| On-chip ADC | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) | Yes (12-bit) |
| Approx. Unit Price (qty 1000) | $6.20 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Lower cost at qty 1000 than industrial temperature variant (vs 10M02SCU324I7G)
- Faster speed grade than A7 variant at comparable price (vs 10M02SCU324A7G)
- Same package as 10M02DCU324C8G with single-image boot flow (vs 10M02DCU324C8G)
Design Notes
The 324-ball UBGA package requires a 4-layer PCB minimum with microvia stack-ups or 6 layers with dog-bone fanout to break out the 0.8 mm pitch BGA. Decoupling: place one 100 nF X7R 0402 capacitor per VCCIO and VCCINT pin pair within 2 mm of the package balls. Add four 4.7 uF bulk capacitors distributed around the package perimeter to handle inrush during configuration flash reads, per Intel MAX 10 hardware design guidelines.
For LVDS outputs above 200 Mbps, route the LVDS pairs as 100 ohm differential traces with length matching within 150 mils. Use the dedicated PLL outputs to clock high-speed interfaces and avoid using regular GPIO clock trees for DDR or SDR data, since jitter exceeds LVDS specifications. Per Intel AN 571, the I/O banks closest to the PLL outputs should be used for high-speed LVDS channels to minimize trace length.
Do not leave the nCONFIG or nSTATUS pins floating; they require a 4.7 kohm pull-up to VCCIO_3V3 for proper configuration startup. The JTAG TCK pin must also be pulled low or high during normal operation to prevent accidental boundary-scan access. The configuration flash must be erased before re-programming via JTAG if the previous image was written through Active Serial, otherwise the AS controller may lock out JTAG access per the MAX 10 Configuration User Guide.
Although the MAX 10 family is fabricated on 55 nm embedded flash, sustained high-utilization designs with all 125 I/Os switching at full speed can dissipate up to 1.5 W, raising junction temperature above the 0 C to +85 C commercial limit without copper cooling. Use at least a 50 mm x 50 mm 4-layer PCB with a continuous inner ground plane; for enclosed industrial enclosures, add 5 mm x 5 mm thermal vias under the exposed pad ball array. Estimated: 1.5 W into 30 C/W theta_JA = 45 C rise above ambient, exceeding the commercial limit at 40 C ambient - derating required.
Compliance Information
RoHS and REACH compliance per Intel/Altera product declaration. Not AEC-Q100 qualified - this is a commercial-grade FPGA, not an automotive-grade part.
