APA150-FG144I - 150K-Gate Flash FPGA | Microchip | 144-LBGA
MPN: APA150-FG144I ✓ نشطAPA150-FG144I نظرة عامة
A field-programmable gate array, or FPGA, is a programmable-logic semiconductor whose internal digital circuits can be configured after fabrication. FPGAs occupy a position between fixed-function ASICs and software-programmable processors. Unlike a mask-programmed ASIC, an FPGA can be reconfigured during development or field updates. Unlike an SRAM FPGA, the APA150 uses embedded nonvolatile flash, so its configuration is retained without continuously rewriting a volatile memory cell.
The APA150-FG144I provides 150K system gates and 100 I/Os in a compact 144-ball surface-mount package. Its nonvolatile configuration supports designs requiring persistent logic at power-up without an external configuration PROM. According to Microchip's ProASICPLUS information, reprogrammability, nonvolatility, live-at-power-up behavior, and an ASIC-oriented design flow are central family features.
The flash-based architecture also differentiates the device from SRAM FPGA families. Microchip states that ProASICPLUS devices do not produce the power-on current surges and high-current transitions associated with SRAM configuration memories. Their lower dynamic power behavior is useful in battery-operated and power-sensitive equipment, where startup behavior and sustained energy use can determine practical operating time.
Typical uses include industrial control and instrumentation, embedded protocol bridging, sensor acquisition, power-management sequencing, communications infrastructure, and compact embedded systems requiring nonvolatile programmable logic. The APA150 family is particularly suitable when designers want the flexibility of field programming while avoiding the recurring configuration-memory overhead of SRAM-based FPGAs.
Layout should be planned around the 144-ball grid, power distribution, decoupling, configuration access, and programmed I/O standards. Confirm the exact ball assignments, supported I/O voltage combinations, configuration pins, clock requirements, and programming interface in the manufacturer datasheet before releasing the PCB or production design.
This product overview combines the identified 150K-gate, 100-I/O, and 144-LBGA characteristics with practical guidance for FPGA selection, pin-compatible family alternatives, comparison tables, and design considerations that support faster engineering decisions.
بدائل مباشرة لـ APA150-FG144I — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع APA150-FG144I (نفس عامل الشكل والبصمة) — يختلف في Device Type, User I/O Count.
APA150-FGG144I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
APA150-FG144
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←APA150-FGG144
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
APA150-FG144I الحدود القصوى والخصائص الكهربائية
| Device Type | ProASICPLUS field-programmable gate array |
| Programmable Logic Capacity | 150K system gates |
| User I/O Count | 100 I/Os |
| Configuration Memory Technology | Nonvolatile flash |
| Power-Up Behavior | Live at power-up |
| Programmability | Reprogrammable |
| Package Type | 144-LBGA square surface-mount package |
| Terminal Count | 144 balls |
| Package Dimensions | 13 mm x 13 mm |
| نوع التركيب | Surface mount |
| Temperature Grade | Industrial grade |
| درجة حرارة التشغيل | -40 °C to +85 °C |
| جهد التغذية | 2.3 V to 2.7 V |
| Power Consumption Characteristic | Lower dynamic power consumption than SRAM FPGAs |
| Power-On Current Surge | No SRAM-style power-on configuration current surge |
| Design Flow | ASIC-oriented FPGA design flow |
دليل تكوين أطراف APA150-FG144I 13 mm x 13 mm
تكوين الأطراف لـ APA150-FG144I (حزمة 13 mm x 13 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ APA150-FG144I.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
APA150-FG144I مناسب لـ 6 التطبيقs: Industrial Control and Automation, Sensor Acquisition and Signal Conditioning, Embedded Protocol Bridging, Power Management Sequencing, Battery-Powered Embedded Instruments, Communications and Network Interface Control.
Industrial Control and Automation
The APA150-FG144I fits industrial controllers that combine deterministic control logic with a moderate number of external interfaces. Its 150K system gates provide capacity for sequencing, state-machine, and protocol-handling blocks, while 100 I/Os support sensors, actuators, status indicators, and communication transceivers. Nonvolatile flash configuration and live-at-power-up behavior allow the controller to resume its configured logic after power restoration without a separate volatile configuration source. The industrial temperature range of -40 °C to +85 °C and the 144-LBGA surface-mount package support compact control boards operating across factory environments.
Sensor Acquisition and Signal Conditioning
The APA150-FG144I can coordinate sensor acquisition, digital filtering, thresholding, and data formatting in compact instrumentation. Its 100 I/Os provide connections for sensor outputs, reference signals, switches, status LEDs, and data-capture interfaces, while the 150K system gates can host parallel acquisition logic, control state machines, and communication formatting. Because configuration is retained in nonvolatile flash, calibration or control logic can remain active at power-up without an SRAM configuration reload. The 2.3 V to 2.7 V operating supply also aligns with low-voltage signal-chain designs, subject to the specific I/O and core voltage requirements in the datasheet.
Embedded Protocol Bridging
The APA150-FG144I is appropriate for protocol converters, legacy interface adapters, and embedded communications controllers that need programmable logic close to the physical interface. With 150K system gates and 100 I/Os, it can combine serial framing, CRC generation, buffering, timeout management, and parallel-to-serial conversion in one device. Live-at-power-up operation allows the bridging function to become operational rapidly after power application, while nonvolatile flash retains the programmed protocol logic. The 144-LBGA package accommodates the required power, ground, clock, configuration, and I/O balls without moving to a larger board outline.
Power Management Sequencing
The APA150-FG144I can act as a configurable supervisor and sequencing controller in power systems. Its programmable logic can monitor enables, fault signals, and rail-status inputs, then generate ordered control actions for external regulators and load switches. Flash-based configuration provides deterministic startup behavior and avoids the large power-on configuration transitions associated with SRAM FPGA families. With 100 I/Os, the controller can support multiple monitored rails, discrete fault inputs, relay or load-control outputs, and status reporting. The -40 °C to +85 °C industrial range suits equipment exposed to uncontrolled ambient conditions.
Battery-Powered Embedded Instruments
The APA150-FG144I supports battery-powered instruments where configuration retention and operating efficiency are important. Nonvolatile flash preserves the programmed logic without a continuously powered SRAM configuration cell, and live-at-power-up operation permits rapid entry into the intended function after power is restored. Microchip identifies ProASICPLUS devices as suitable for power-sensitive applications with lower dynamic power consumption than SRAM FPGAs. The 100 I/Os can connect sensors, buttons, displays, and low-power communications, although overall battery life still depends on clocking, I/O activity, external component loading, and the power-management architecture selected for the complete product.
Communications and Network Interface Control
The APA150-FG144I can implement dedicated interface-control logic around network, storage, or industrial communications equipment. Its 150K system gates support parallel data movement, packet filtering, FIFO control, and protocol state machines, while 100 I/Os provide access to buses and status signals. Live-at-power-up operation is valuable in systems that must initialize communication logic immediately after supply stabilization, and nonvolatile configuration preserves a stable function across power cycles. In a 144-LBGA package, engineers must plan power and ground distribution carefully and confirm supported I/O standards, clocking, and timing for the selected external interface.
بيانات مرجعية هندسية لـ APA150-FG144I — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | APA150-FGG144I | APA150-FG144 | APA150-FGG144 |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LBGA (FBGA) | 144-LBGA (FBGA) | 144-LBGA (FBGA) | 144-LBGA (FBGA) |
| Device Type | ProASICPLUS flash FPGA | ProASICPLUS flash FPGA | ProASICPLUS flash FPGA | ProASICPLUS flash FPGA |
| Configuration Memory | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash | Nonvolatile flash |
| Power-Up Behavior | Live at power-up | Live at power-up | Live at power-up | Live at power-up |
| Programming Method | ProASICPLUS flash programming workflow | ProASICPLUS flash programming workflow | ProASICPLUS flash programming workflow | ProASICPLUS flash programming workflow |
أبرز الفروقات
- Nonvolatile configuration with immediate startup behavior (مقابلSRAM-based FPGA designs)
- Moderate logic and interface capacity in a compact BGA (مقابلAPA150-FG144)
- Same-family alternative simplifies qualification (مقابلAPA150-FGG144I)
ملاحظات التصميم
Treat the 144-LBGA footprint as a dense BGA escape problem rather than a conventional perimeter-lead layout. Assign power and ground balls first, place adequate decoupling close to each supply pin, and route high-speed or sensitive nets through the shortest practical paths. Check the manufacturer ball-view convention against the CAD footprint, especially the pin-1 orientation, before fabrication. Because the device has 100 user I/Os among 144 balls, use the pin-description table to distinguish programmable I/O from power, configuration, clock, and ground positions.
Plan the power tree around the listed 2.3 V to 2.7 V supply range and the device's specific core and I/O requirements. Place bulk and high-frequency decoupling according to the manufacturer recommended circuit, provide a low-impedance return path for every ground ball, and isolate noisy switching nodes from sensitive programmable inputs. The flash architecture avoids SRAM-style power-on configuration surges, but the final board still needs controlled ramp time and adequate sequencing to protect device reliability.
Confirm configuration pins, programming interface signals, clock requirements, and dedicated test functions from the manufacturer pin table before committing the schematic. Match the exact FG144 ordering variant and its package drawing to the PCB library. Avoid assigning I/O standards solely by ball availability: verify each voltage domain, drive strength, slew rate, and supported input or output type. This prevents a package-compatible substitution from creating electrical or timing incompatibility.
Do not treat the APA150-FG144, APA150-FGG144I, and APA150-FGG144 ordering codes as automatically interchangeable. The differences may involve speed grade, temperature grade, or package-related ordering conventions. Review the manufacturer device-selection table, timing specifications, and configuration identifiers for each exact MPN. Also verify the requested delivery format: the target is specified as a 144-LBGA industrial-grade device, and a tray is identified as the standard handling format.
معلومات الامتثال
RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status require confirmation from Microchip for the exact APA150-FG144I ordering code.
